In-situ study of creep in Sn-3Ag-0.5Cu solder (2020)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.2006.05904
Publication URI: https://arxiv.org/abs/2006.05904
Type: Preprint