Advanced Pb-free interconnect materials and manufacture processes to enable high-temperature electronics packaging (2022)

First Author: Liu C

Attributed to: Underpinning Power Electronics 2017: Heterogeneous Integration funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.26174/thesis.lboro.21397191

Publication URI: https://repository.lboro.ac.uk/articles/thesis/Advanced_Pb-free_interconnect_materials_and_manufacture_processes_to_enable_high-temperature_electronics_packaging/21397191

Type: Other