Advanced Pb-free interconnect materials and manufacture processes to enable high-temperature electronics packaging (2022)
Attributed to:
Quasi-ambient bonding to enable cost-effective high temperature Pb-free solder interconnects
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.26174/thesis.lboro.21397191
Type: Other