Splashing of Sn-Bi-Ag solder droplets (2023)
Attributed to:
Electro-Collapse Jetting: Towards the Next Generation of Printing Technologies
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1063/5.0155328
Publication URI: http://dx.doi.org/10.1063/5.0155328
Type: Journal Article/Review
Parent Publication: Physics of Fluids
Issue: 8