Understanding die attach materials performance in electronic packages under harsh environments (2010)
Attributed to:
DURABLE HIGH TEMPERATURE ELECTRONICS PACKAGING FOR DOWN-WELL APPLICATIONS
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/estc.2010.5642948
Publication URI: http://dx.doi.org/10.1109/estc.2010.5642948
Type: Conference/Paper/Proceeding/Abstract
ISBN: 978-1-4244-8553-6