Stress in electroplated gold on silicon substrates and its dependence on cathode agitation (2013)

First Author: Pu S
Attributed to:  Integrated Functional Materials for System-in-Package Applications funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.mee.2013.05.019

Publication URI: http://dx.doi.org/10.1016/j.mee.2013.05.019

Type: Journal Article/Review

Parent Publication: Microelectronic Engineering