Contactless Thermal Boundary Resistance Measurement of GaN-on-Diamond Wafers (2014)

First Author: Pomeroy J
Attributed to:  Novel High Thermal Conductivity Substrates for GaN Electronics: Thermal Innovation funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/led.2014.2350075

Publication URI: http://dx.doi.org/10.1109/led.2014.2350075

Type: Journal Article/Review

Parent Publication: IEEE Electron Device Letters

Issue: 10