Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate (2012)
Attributed to:
Power Electronics for Adverse High Temperature Environments (PEATE)
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.jallcom.2012.08.023
Publication URI: http://dx.doi.org/10.1016/j.jallcom.2012.08.023
Type: Journal Article/Review
Parent Publication: Journal of Alloys and Compounds