Electro-thermal modelling of multichip power modules for high power converter application (2017)
Attributed to:
Underpinning Power Electronics 2012: Components Theme
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/icept.2017.8046599
Publication URI: http://dx.doi.org/10.1109/icept.2017.8046599
Type: Conference/Paper/Proceeding/Abstract