Innovative 3C-SiC on SiC via Direct Wafer Bonding (2013)
Attributed to:
Vehicle Electrical Systems Integration (VESI)
funded by
UKRI
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.271
Publication URI: http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.271
Type: Journal Article/Review
Parent Publication: Materials Science Forum