NUMERICAL SIMULATION OF HEAT TRANSFER ENHANCEMENT FOR COPPER FOAM HEAT SINK IN ELECTRONIC DEVICES USING WATER BASED BN NANOFLUIDS (2018)
Attributed to:
Integrated GaN-Diamond Microwave Electronics: From Materials, Transistors to MMICs
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1615/ihtc16.ctm.023451
Publication URI: http://dx.doi.org/10.1615/ihtc16.ctm.023451
Type: Conference/Paper/Proceeding/Abstract
ISSN: 2377424X