GaN-on-diamond: The correlation between interfacial toughness and thermal resistance (2020)

First Author: Field D.E.
Attributed to:  Integrated GaN-Diamond Microwave Electronics: From Materials, Transistors to MMICs funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Type: Other

Parent Publication: CS MANTECH 2020 - 2020 International Conference on Compound Semiconductor Manufacturing Technology, Digest of Papers