Hermetic chip-scale packaging using Au:Sn eutectic bonding for implantable devices (2021)

First Author: Szostak K

Attributed to: Empowering Next Generation Implantable Neural Interfaces funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.48550/arxiv.2105.13156

Publication URI: https://arxiv.org/abs/2105.13156

Type: Other