UK Integrated Supply Chain to support Vishay – UKISC-V
Lead Participant:
RAM INNOVATIONS LTD
Abstract
**UK** **I**ntegrated **S**upply **C**hain to support **V**ishay - **UKISC-V**
UKISC-V will create a value chain spanning design, wafer fabrication, testing and advanced packaging to complement Vishay's acquisition of Newport Wafer Fab.
KuasaSemi is a Technology Computer Aided Design (TCAD) business that is developing software tools to design and simulate wide bandgap (WBG) devices at a fraction of the time and cost of existing software.
RAM Innovations has developed a heterogeneous packaging capability that will be used to assemble a power module incorporating Vishay die to demonstrate the significant size reduction and improvement in efficiency that can be achieved through embedding.
KuasaSemi's software and RAM's power module performance shall be validated prior to inclusion in Vishay's ecosystem roadmap.
UKISC-V will create a value chain spanning design, wafer fabrication, testing and advanced packaging to complement Vishay's acquisition of Newport Wafer Fab.
KuasaSemi is a Technology Computer Aided Design (TCAD) business that is developing software tools to design and simulate wide bandgap (WBG) devices at a fraction of the time and cost of existing software.
RAM Innovations has developed a heterogeneous packaging capability that will be used to assemble a power module incorporating Vishay die to demonstrate the significant size reduction and improvement in efficiency that can be achieved through embedding.
KuasaSemi's software and RAM's power module performance shall be validated prior to inclusion in Vishay's ecosystem roadmap.
Lead Participant | Project Cost | Grant Offer |
|---|---|---|
| RAM INNOVATIONS LTD | £347,399 | £ 243,179 |
Participant |
||
| VISHAY LTD. | £14,400 | |
| KUASASEMI LTD | £111,390 | £ 77,973 |
People |
ORCID iD |
| Daryl Bunnell (Project Manager) |