AGPI Sensor = Airborne Ground Penetrating Imaging Sensor

Abstract

The aim of this 6 month Proof of Market project is to investigate the commercial feasibility of
a sensor to image a 3D sub-surface structure from an aircraft, using either a frequency chirped,
or an Ultra-Wideband Impulse radio signal, that is transmitted from an antenna mounted on
each wing tip of an aircraft. This is analogous to the illumination of the underlying terrain
using two searchlights, except that the signals pass through the underlying ground, to a depth
depending on the conductivity of the soil, or ice, enabling the detection of sub-surface
features. The reflected signals from dielectric discontinuities, such as rocks, are detected by
two linear phase sensitive arrays of antennas, mounted on the underside of the wings.
As the aircraft flies along, a 2D array of reflected signals is digitised and recorded for
subsequent data processing. This is like performing an acoustic seismic survey but using an
aircraft rather than a "vibroseis" truck, or a team of people carrying the seismic sensors, to
achieve a far larger coverage per survey day, regardless of the harshness of the terrain.
We will explore ways in which we could subsequently work with Dr Hugh Corr at the British
Antarctic Survey (BAS), to enable the 3D profiling of the ice in the Antarctic, which can be
up to 5 km in depth. In a follow on activity to this project, we would use our experience in
microwave imaging and the BAS experience with a Ground Penetrating RADAR, to develop
a prototype sensor and the associated data processing software.
This sensor will find use in oil, gas and mineral exploration work, representing the business
oriented aspect of this work. Societal benefits include contributing to measurements of
melting ice in Antarctica and furthering the search for oil and minerals.
The economic benefits will stem from sales of this sensor, which will be attached to the
underside of the wings of our InView unmanned aircraft, for use in exploration work and in
military applications.

Lead Participant

Project Cost

Grant Offer

 

Participant

BARNARD MICROSYSTEMS LIMITED

Publications

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