CONECT: Novel All Copper Interconnect for Power Electronics Assembly
Lead Participant:
DYCOTEC MATERIALS LTD
Abstract
A novel all copper interconnect technology will be developed and demonstrated as an alternative to nanosilver die attach materials for semiconductor power devices such as Insulated-Gate Bipolar Transistors (IGBTs) and Metal-oxide-semiconductor field effect transistors (MOSFETs).
Lead Participant | Project Cost | Grant Offer |
|---|---|---|
| DYCOTEC MATERIALS LTD | £96,052 | £ 96,052 |
People |
ORCID iD |
| Richard Dixon (Project Manager) |