Tamessa - Turning up the heat in electronics

The Tamessa project represents a step change in harsh environment electronic assembly. Tamessa will develop a integrated system will eliminate the need to use expensive & heavy ceramic technologies in applications up to 225Deg C and allow the integration of bespoke through hole components. Typical applications benefiting from this system are aerospace, automotive, offshore & power management or other areas were electronics are subjected to high temperature, salt and hydrocarbons. OEMs will benefit from 30% reduction in board cost, 50% reduction in board weight and 95% reduction in tooling NRE cost. Energy cost associated with manufacture are signifcantly reduced.