Validation of novel method of tin oxide characterisation in electronic components as part of supply chain quality assurance

Adaptix develops novel 3D X-ray imaging technology for medical applications. A prototype has also been tested in Non-Destructive Testing (NDT) applications to inspect electronics devices and components and far exceeded the imaging capability of current 2D x-ray NDT systems. It also has a smaller footprint, is lower cost and produces less flux (requires less shielding to be safe, so portable for desktop use). The aim is to deliver a novel and commercially attractive alternative to the industry's existing quality assurance procedures, which involve manual handling of each sample with a microscope: the industry needs automated, cheap quality assurance methods, applicable quickly, to an entire batch of samples.

This project will lay the groundwork to add a new and complementary capability of multi-modal imaging to our existing 3D x-ray product. Specifically, Adaptix aims to incorporate multi-wavelength optical imaging within the shielded x-ray cabinet. Concurrent to the X-ray scan, we will conduct an optical scan that will be used to detect oxidation.

Tin oxide has differential absorption of different optical wavelengths, a characteristic we aim to exploit. With an optical scan we want to detect tin oxide on electronic connectors. Such oxides form when the components have not been maintained in an appropriate environment. Detecting tin oxide may also indicate if counterfeit/refurbished parts have been mixed into supposedly new products, which is often the case in global and unregulated supply chains where parts are bought and sold many times. Of the annual $800bn in semiconductors sales,~ $32bn go through 'channel'. The US Navy estimates 15% of its electronic parts are counterfeit, and this is probably a better controlled environment than the majority of supply chains.

The industry requires a low-cost method of increasing test throughput (potentially to 100%). It is important to reduce total test cost and the need for expensive and scarce trained electronics inspectors. This adds significant value to our 3D X-ray system for NDT applications. It would offer a highly novel and market-leading feature (in a new market) for the second version of the system to drive further revenues and industry-benefit.

NPL will help us develop a test to identify the presence of tin oxide on the components. They will also help to establish the sensitivity and specificity of this approach, and establish the wavelength needed to maximise signal-detection and resolution, and identify commercially available source that are capable of delivering this.