(PITCH) advanced PackagIng Test probe Card laser microHoles
Lead Participant:
OXFORD LASERS LIMITED
Abstract
More-than-Moore's law increasingly drives advanced packaging technologies and probecard testing developments for semiconductor wafer-level testing. Sophisticated custom-made probecards for each IC design are used to establish Known-Good-Die before packaging and hence critical .
PITCH will develop ultra-high precision laser drilling for next generation (affordable) fine-pitch probecards urgently required by node size reduction below 5nm.
PITCH will develop ultra-high precision laser drilling for next generation (affordable) fine-pitch probecards urgently required by node size reduction below 5nm.
Lead Participant | Project Cost | Grant Offer |
|---|---|---|
| OXFORD LASERS LIMITED | £499,281 | £ 299,569 |
People |
ORCID iD |
| Dimitris Karnakis (Project Manager) |