SINES (SINtering of Embedded Semiconductors)

RAM Innovations designs and manufactures high power density power electronics modules. This world leading power density is achieved through the embedding of bare die GaN and SiC power devices directly into printed circuit boards. RAM is investing in its manufacturing processes and equipment to enable it meet the growing demand for high power density electronics, critical to support the transition to Net-Zero through the electrification of transport and other industries.

Project SINES (SINtering of Embedded Semiconductors) is focused on ensuring RAM has access to the latest Sintering technology to enable a high throughput, high yield and cost-effective volume manufacturing process.