Feasabillity of Packaging Techniques For Future High Power GaN Microwave Devices

Our target is to develop a die attach method and package construction which will enable Filtronic Broadband to assemble Gallium Nitride (GaN) power semiconductor devices into low cost surface mountable packages, having the same level of reliability and performance as more expensive ceramic/glass based packages currently available on the market. This will result in a solution which is cost effective, easy to manufacture, and will enable GaN technology to be exploited in areas where it is currently not considered to be feasible.