SUStainable PLA Adhesives Emulsified for Flexible Packaging FORMulations (SUSPLAFORM)
Lead Participant:
SCITECH ADHESIVE SYSTEMS LIMITED
Abstract
The project is a feasibility study to look at the development and formulation of an emulsified biobased laminating adhesive for the flexible packaging applications. The new adhesive system will have good stability, a high solid content and a fast cure speed at low temperatures. It will be suitable for industrial compositing and or anaerobic digestion at end of life.
Lead Participant | Project Cost | Grant Offer |
|---|---|---|
| SCITECH ADHESIVE SYSTEMS LIMITED | £60,335 | £ 45,251 |
Participant |
||
| BANGOR UNIVERSITY N WALES | £19,980 | £ 19,980 |
People |
ORCID iD |
| Trevor Jones (Project Manager) |