ED-PCB: EMBEDDED DIE AND SENSORS IN PCB SUBSTRATES

Abstract

This project will evaluate the feasibility of embedding semiconductor sensor die into PCBs. Embedded Die-PCB (ED-PCB) assemblies will be derived to high specifications to address applications in hostile environments, eg for operating temperatures in excess of 200C and pressure environments in excess of 2000psi.
The primary demonstrator product is a sensor enabled, intelligent gasket seal for fluid transport in the Nuclear, Energy and Process Industry. Its purpose is to provide continuous data on critical seals and joints and thereby prevent serious nuclear and process accidents, fugitive emissions and costly downtime of valuable plant installations.
The key to successful exploitation of this technology is the demonstration of a flexible, generic manufacturing platform which can realise a wide variety of designs for multiple applications. Specific examples used in this study are high temperature sensing products and 3D integration market for medical products.

Lead Participant

Project Cost

Grant Offer

Microsemi Semiconductor Limited, Bristol £50,489 £ 32,818
 

Participant

Compound Semiconductor Technologies Global Limited, Blantyre, UK £24,424 £ 18,000

Publications

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