Manufacturing innovations in ultra high frequency interconnect technology

The rapidly increasing data-traffic in mobile wireless networks has led to very stong interest in use of spectrum between 57 and 95 GHz where wide bandwidths are available to support the high data rates required. However, such networks will not be viable unless the high frequency hardware is manufactured in a low cost, high volume environment. One key aspect to enable this is to maximise the manufacturing efficiency and yield. This can only be done by eliminating any form of manual processes. FBL has found that one of the largest impacts on manufacturing yield is variability of the manually formed connections between mm-wave integrated circuits and printed circuit boards. It is the intention of this project to innovate alternative high precision and low cost methods for interconnecting such devices. This underpins UK electronics leading position in the design of high technology electronics with an innovative manufacturing processes which will enable these designs be manufactured in volume.