FLEXIDISC (FLEXIble DISplays Circuitry)

The aim of this project is to exploit recent advances in printed electronics components and demonstrate the feasibility of integrating flexible driver circuitry with a flexible display on plastic. This project addresses three key technical innovations: printed logic circuitry to drive display modules (reducing interconnect complexity), flex-to-flex interconnections to enable robust hybrid systems integration and development of low-voltage plastic displays (<5V). The project outcomes will initially address the toys&games and consumer packaging sectors, with long-term opportunites for wearable electronics, healthcare, automotive and defence/military. The project also supports development of components/systems suitable for wireless sensor networks (WSN) and the Internet-of-Things (IoT).