OrCA - Organic hybrids for Circuit Assemblies
Lead Participant:
GWENT ELECTRONIC MATERIALS LIMITED
Abstract
There are an increasing number of electronics applications in aerospace, automotive, offshore, shale gas & power
management, which are required to operate at or above 200C. Organic reinforced substrates such as polyimide
have maximum operating temperatures of up to 140C, so such applications are forced to use expensive & heavy
ceramic technologies. Such assemblies are based on alumina substrates with printed inks fired at ~ 850C. The
OrCA project with investigate replacing the alumina with high temperature engineering thermoplastics such as
PEEK and utilising silicone based ink systems curing at around 250C. Component interconnect will exploit the
ELCOSINT conductive adhesive system developed by the project partners in a recent Innovate funded project.
Such an assembly system will benefit from reductions in substrate cost, and assembly weight. Energy cost
associated with manufacture will be significantly reduced. In addition the organic substrate will be easier to
machine and form into complex shapes and offers the possibility of integrating through-hole components and
thermal management solutions. The suitability of such a system to operate continuously at 250C will be explored.
management, which are required to operate at or above 200C. Organic reinforced substrates such as polyimide
have maximum operating temperatures of up to 140C, so such applications are forced to use expensive & heavy
ceramic technologies. Such assemblies are based on alumina substrates with printed inks fired at ~ 850C. The
OrCA project with investigate replacing the alumina with high temperature engineering thermoplastics such as
PEEK and utilising silicone based ink systems curing at around 250C. Component interconnect will exploit the
ELCOSINT conductive adhesive system developed by the project partners in a recent Innovate funded project.
Such an assembly system will benefit from reductions in substrate cost, and assembly weight. Energy cost
associated with manufacture will be significantly reduced. In addition the organic substrate will be easier to
machine and form into complex shapes and offers the possibility of integrating through-hole components and
thermal management solutions. The suitability of such a system to operate continuously at 250C will be explored.
Lead Participant | Project Cost | Grant Offer |
---|---|---|
GWENT ELECTRONIC MATERIALS LIMITED | £61,369 | £ 42,958 |
  | ||
Participant |
||
NPL MANAGEMENT LIMITED | £33,295 | £ 16,648 |
MICROCHIP TECHNOLOGY CALDICOT LIMITED | £9,806 | £ 4,903 |
People |
ORCID iD |
Robin Pittson (Project Manager) |