TRIuMPHANT: TheRmal Interface Material based on Phase Cahange MAterials for Heat mANagemenT

Electronic technology is continuously advancing and increasingly impacting on all areas of life and business through the use of products (such as mobile phones, lap-tops, tablets, and LED lighting) where there is an increasing need for higher power and more compact electronics. As a result, overheating is becoming a critical issue limiting further miniaturisation, power, performance & reliability. Thermal management to reduce heat build-up and minimise thermal damage is a critical need for a range of customers such as large electronic OEMs including: Intel, Apple, HP, Sony, Siemens, Sharp, Panasonic, Cisco and LG. These OEMs are actively searching for Thermal Interface Materials (TIMs) that can be applied to their market offerings. Due to the tight cost constraints within this industry, it is important that any solution can be applied quickly and cost-effectively preferably using existing equipment. The TRIuMPHANT project Approach and Innovation is to develop a Phase Change Thermal Interface Material that can achieve thermal conductivity >7W/m.K, twice that currently achievable, that can be cost-effectively applied using conventional deposition techniques. Exploitation of the technology through our existing global network of distributors will result in significantly increased revenues and profits, making our consortium partners more competitive globally. Manufacture in the UK (Swindon and Leicestershire) will also give us greater control of the supply chain and quality, allowing us to achieve long-term competitiveness.