An Innovative Electronics Manufacturing Research Centre
Lead Research Organisation:
Loughborough University
Department Name: Sch of Mechanical and Manufacturing Eng
Abstract
The IeMRC is one of 16 Innovative Manufacturing Research Centres (IMRCs) set up and supported by the Engineering and Physical Sciences Research Council (EPSRC), focussing on the electronics manufacturing sector.With more than 5 million funding over 5 years (2004-2009), the IeMRC is distributed among a number of universities and has a 'hub' at Loughborough, UK. Other UK universities involved in the operation of the Centre include Bath, Brunel, Greenwich, Lancaster, Heriot-Watt and Nottingham. This is a proposal to renew the IeMRC for a further 5 years, from March 2010.Compared with the other Innovative Manufacturing Centres established with EPSRC support, the IeMRC differs in being a distributed research operation rather than having a fixed location for its research activities. Universities across the UK are able to bid for funds from the Centre, so encouraging open collaboration between groups. The advantage of a distributed programme, compared with a single centre, is that it allows the most appropriate people to do the work for an industry that has now become very diverse.Key elements of the IeMRC are the high level of industrial involvement and strong industrial steering group that decides priorities for funding. As with other IMRCs, the contribution from industry in resources and cash will at least match the EPSRC funds.
Planned Impact
Please see attached covering letter.
Organisations
- Loughborough University (Lead Research Organisation)
- National Renewable Energy Centre (Collaboration)
- Micro-Materials Ltd. (Collaboration)
- EM Systems Support (Collaboration)
- Institute of Circuit Technology (Collaboration)
- MacDermid Industrial Solutions (Collaboration)
- TT-electronics Semelab (Collaboration)
- Airborne Environmental Consultants (AEC) (Collaboration)
- Dynex Semiconductor (Collaboration)
- TWI The Welding Institue (Collaboration)
- Rolls Royce Group Plc (Collaboration)
- IQE Europe Limited (Collaboration)
- SONY (Collaboration)
- INEX Microtechnology (Collaboration)
- Camvac Ltd (Collaboration)
- University of Bath (Collaboration)
- EADS Astrium (Collaboration)
- Kelan Cicuits Ltd (Collaboration)
- University of Franche-Comté (Collaboration)
- C-MAC (Collaboration)
- Conpart (Collaboration)
- Advanced Therapeutic Materials (Collaboration)
- Memsstar (Point 35 Microstructures) (Collaboration)
- TaiCaan Technologies Ltd (Collaboration)
- University of Maryland, College Park (Collaboration)
- Dalmatian Technology (Collaboration)
- Whitfield Solar (Collaboration)
- Accelonix (Collaboration)
- SP Technical Institute of Sweden (Collaboration)
- Ultra Electronics (Collaboration)
- Oxford Instruments (United Kingdom) (Collaboration)
- Intrinsiq Materials Ltd (Collaboration)
- Antenova M2M (Collaboration)
- Axess Technologies (Collaboration)
- Aero Engine Controls (Collaboration)
- Procter & Gamble (Collaboration)
- Precision Micro (Collaboration)
- Nampak Healthcare (Collaboration)
- CRDM (Collaboration)
- General Electric (Collaboration)
- Finetech (Collaboration)
- Parkside Hospital (Collaboration)
- Qinetiq (United Kingdom) (Collaboration)
- National Physical Laboratory (Collaboration)
- RFMD (UK) (Collaboration)
- Vistec (Collaboration)
- Chestech (Collaboration)
- UNIVERSITY OF EDINBURGH (Collaboration)
- GE Power & Conversion (Collaboration)
- Selex ES (Collaboration)
- Gen3 Systems (Collaboration)
- GE Aviation Systems (Collaboration)
- Plextek (Collaboration)
- E2V Technologies (Collaboration)
- MINISTRY OF DEFENCE (Collaboration)
- Institute of Metal Finishing (Collaboration)
- Scott Bader Co Ltd (Collaboration)
- Texas Instruments (United States) (Collaboration)
- ST MICROELECTRONICS (Collaboration)
- Georgia Institute of Technology (Collaboration)
- Silvaco, Inc (Collaboration)
- DuPont Teijin Films (Collaboration)
- MBDA Missile Systems (Collaboration)
- Invotec Group LTD (Collaboration)
- Renishaw (United Kingdom) (Collaboration)
- Ceimig (Collaboration)
- Signature Industries Limited - SABRE (Collaboration)
- Pyreos (Collaboration)
- University of the West of England (Collaboration)
- Rutherford Appleton Laboratory (Collaboration)
- Wolfson Microelectronics (Collaboration)
- General Vacuum Equipment (Collaboration)
- Antrum (Collaboration)
- Alstom (Collaboration)
- Graphic Circuits (Collaboration)
- Printed Electronics Ltd (Collaboration)
- Areva (Collaboration)
- Semefab (Scotland) Ltd (Collaboration)
- BAE Systems (United Kingdom) (Collaboration)
Publications
A Ballantyne
(2015)
A new high reliability surface finish for PCBs
in The PCB Magazine
A Ballantyne
(2014)
Sustainable Solder Flux from Novel Ionic Liquid Systems
in The Journal of the Institute of Circuit Technology
A Ballantyne
(2013)
Universal Solder Flux for the Electronics Industry
A Campos-Zatarain
(2014)
Characterization of Cu-Sn SLID interconnects for harsh environment applications
A Chauraya
(2013)
Repeatability of embroidered patch antennas
Description | The IeMRC was a national manufacturing centre award that funded 22 universities addressing challenges in electronics manufacturing, ranging from new materials development, manufacturing processes and technologies to design methodologies and end of life and sustainability issues. |
Exploitation Route | A multitude of routes forward for the 40+ research projects funded by the centre. Some licenses, spin outs, technology transfer via KTPs and transfer of people and graduating PhD students. |
Sectors | Aerospace Defence and Marine Communities and Social Services/Policy Digital/Communication/Information Technologies (including Software) Electronics Energy Environment Healthcare Manufacturing including Industrial Biotechology Transport |
URL | http://www.lboro.ac.uk/microsites/research/iemrc/ |
Description | EPSRC Centre for Doctoral Training in Embedded Intelligence |
Amount | ÂŁ3,567,115 (GBP) |
Funding ID | EP/L014998/1 |
Organisation | Engineering and Physical Sciences Research Council (EPSRC) |
Sector | Public |
Country | United Kingdom |
Start | 02/2014 |
End | 10/2022 |
Description | EPSRC Impact Accelerator Account Follow-on Funding |
Amount | ÂŁ25,000 (GBP) |
Organisation | Engineering and Physical Sciences Research Council (EPSRC) |
Sector | Public |
Country | United Kingdom |
Start |
Description | Knowledge Transfer partnership |
Amount | ÂŁ118,000 (GBP) |
Funding ID | KTP Project No 9559 |
Organisation | Innovate UK |
Sector | Public |
Country | United Kingdom |
Start |
Description | 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed RFMEMS Components |
Organisation | Antenova M2M |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed RFMEMS Components |
Organisation | EADS Astrium |
Country | France |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed RFMEMS Components |
Organisation | Plextek |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed RFMEMS Components |
Organisation | Ultra Electronics |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed RFMEMS Components |
Organisation | e2v Technologies |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | Carbon Nano Tube (CNT) Composite Surfaces for Electrical Contact Interfaces |
Organisation | C-MAC |
Country | Belgium |
Sector | Private |
PI Contribution | standard project |
Start Year | 2011 |
Description | Carbon Nano Tube (CNT) Composite Surfaces for Electrical Contact Interfaces |
Organisation | Micro-Materials Ltd. |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2011 |
Description | Carbon Nano Tube (CNT) Composite Surfaces for Electrical Contact Interfaces |
Organisation | National Physical Laboratory |
Country | United Kingdom |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2011 |
Description | Carbon Nano Tube (CNT) Composite Surfaces for Electrical Contact Interfaces |
Organisation | TaiCaan Technologies Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2011 |
Description | Conductive Resists for Nanofabrication on Insulating Substrates |
Organisation | Chestech |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Conductive Resists for Nanofabrication on Insulating Substrates |
Organisation | EM Systems Support |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Conductive Resists for Nanofabrication on Insulating Substrates |
Organisation | INEX Microtechnology |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Conductive Resists for Nanofabrication on Insulating Substrates |
Organisation | IQE Europe Limited |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Conductive Resists for Nanofabrication on Insulating Substrates |
Organisation | Oxford Instruments |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Conductive Resists for Nanofabrication on Insulating Substrates |
Organisation | Precision Micro |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Conductive Resists for Nanofabrication on Insulating Substrates |
Organisation | RFMD (UK) |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Conductive Resists for Nanofabrication on Insulating Substrates |
Organisation | Vistec |
Country | Germany |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Costing for Avionic Through-Life Availability (CATA) |
Organisation | BAE Systems |
Country | United Kingdom |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Costing for Avionic Through-Life Availability (CATA) |
Organisation | BAE Systems |
Country | United Kingdom |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Costing for Avionic Through-Life Availability (CATA) |
Organisation | GE Aviation Systems |
Country | United States |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | Costing for Avionic Through-Life Availability (CATA) |
Organisation | Georgia Institute of Technology |
Country | United States |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Costing for Avionic Through-Life Availability (CATA) |
Organisation | Ministry of Defence (MOD) |
Department | Defence Equipment and Support |
Country | United Kingdom |
Sector | Public |
PI Contribution | standard project |
Start Year | 2010 |
Description | Costing for Avionic Through-Life Availability (CATA) |
Organisation | University of Bath |
Department | Innovative Design & Manufacturing Research Centre (IDMRC) |
Country | United Kingdom |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Costing for Avionic Through-Life Availability (CATA) |
Organisation | University of Maryland |
Department | Centre for Advanced Life Cycle Engineering (CALCE) |
Country | United States |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Costing for Avionic Through-Life Availability (CATA) |
Organisation | University of the West of England |
Country | United Kingdom |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Design for increased yield |
Organisation | Accelonix |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2011 |
Description | Design for increased yield |
Organisation | Airborne Environmental Consultants (AEC) |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2011 |
Description | Design for increased yield |
Organisation | General Electric |
Country | United States |
Sector | Private |
PI Contribution | standard project |
Start Year | 2011 |
Description | Design for increased yield |
Organisation | Invotec Group Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2011 |
Description | Design for increased yield |
Organisation | Selex ES |
Department | SELEX Elsag Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2011 |
Description | Design for increased yield |
Organisation | TWI The Welding Institue |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2011 |
Description | Electrochemically assisted integration of organic semiconductors on CMOS and MEMS |
Organisation | Semefab (Scotland) Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | Electrochemically assisted integration of organic semiconductors on CMOS and MEMS |
Organisation | University of Edinburgh |
Department | Scottish Microelectronics Centre |
Country | United Kingdom |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing |
Organisation | Chestech |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing |
Organisation | Graphic Circuits |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing |
Organisation | Institute of Circuit Technology |
Country | United Kingdom |
Sector | Charity/Non Profit |
PI Contribution | standard project |
Start Year | 2012 |
Description | Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing |
Organisation | Intrinsiq Materials Ltd |
Country | United States |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing |
Organisation | Printed Electronics Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | High Performance Flexible, Fabric Electronics for MegaHertz Frequency Communication |
Organisation | Advanced Therapeutic Materials |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | High Performance Flexible, Fabric Electronics for MegaHertz Frequency Communication |
Organisation | Antrum |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | High Performance Flexible, Fabric Electronics for MegaHertz Frequency Communication |
Organisation | Signature Industries Limited - SABRE |
Country | United States |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | High-performance low-cost power modules for energy smart network applications |
Organisation | Areva |
Country | France |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | High-performance low-cost power modules for energy smart network applications |
Organisation | CRDM |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | High-performance low-cost power modules for energy smart network applications |
Organisation | Dynex Semiconductor |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | Micro-interconnects Using Mono-sized Polymer Microspheresfor Large Format High Resolution Sensor Packaging |
Organisation | Conpart |
Country | Norway |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | Micro-interconnects Using Mono-sized Polymer Microspheresfor Large Format High Resolution Sensor Packaging |
Organisation | National Physical Laboratory |
Country | United Kingdom |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Micro-interconnects Using Mono-sized Polymer Microspheresfor Large Format High Resolution Sensor Packaging |
Organisation | Rutherford Appleton Laboratory |
Country | United Kingdom |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Robustness Design and Health Management in Power Electronics using Damage Mechanics-Based Models (RODENT) |
Organisation | Alstom |
Department | Alstom Grid |
Country | France |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Robustness Design and Health Management in Power Electronics using Damage Mechanics-Based Models (RODENT) |
Organisation | Dynex Semiconductor |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Robustness Design and Health Management in Power Electronics using Damage Mechanics-Based Models (RODENT) |
Organisation | GE Power & Conversion |
Department | Converteam UK |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Robustness Design and Health Management in Power Electronics using Damage Mechanics-Based Models (RODENT) |
Organisation | TT-electronics Semelab |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) |
Organisation | Axess Technologies |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) |
Organisation | Camvac Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) |
Organisation | Dalmatian Technology |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) |
Organisation | DuPont Teijin Films |
Country | Global |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) |
Organisation | General Vacuum Equipment |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) |
Organisation | Nampak Healthcare |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) |
Organisation | Parkside Hospital |
Country | United Kingdom |
Sector | Hospitals |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) |
Organisation | Procter & Gamble |
Country | United States |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) |
Organisation | Scott Bader Co Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) |
Organisation | Silvaco, Inc |
Department | Silvaco Europe Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | SUSTAINING ELECTRONIC INDUSTRY THROUGH MANAGING UNCERTAINTY IN CONTRACT BIDDING |
Organisation | BAE Systems |
Department | BAE Systems Australia |
Country | Australia |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | SUSTAINING ELECTRONIC INDUSTRY THROUGH MANAGING UNCERTAINTY IN CONTRACT BIDDING |
Organisation | BAE Systems |
Department | BAE Systems Maritime – Naval Ships |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | SUSTAINING ELECTRONIC INDUSTRY THROUGH MANAGING UNCERTAINTY IN CONTRACT BIDDING |
Organisation | BAE Systems |
Department | BAE Systems Military Air & Information |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | SUSTAINING ELECTRONIC INDUSTRY THROUGH MANAGING UNCERTAINTY IN CONTRACT BIDDING |
Organisation | Rolls Royce Group Plc |
Department | Rolls Royce Submarines |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2012 |
Description | Smart Microsystems |
Organisation | Ceimig |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Smart Microsystems |
Organisation | Memsstar (Point 35 Microstructures) |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Smart Microsystems |
Organisation | National Semiconductor |
Country | United States |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Smart Microsystems |
Organisation | Pyreos |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Smart Microsystems |
Organisation | Qinetiq |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Smart Microsystems |
Organisation | Renishaw PLC |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Smart Microsystems |
Organisation | ST Microelectronics |
Country | Switzerland |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Smart Microsystems |
Organisation | Selex ES |
Department | SELEX Galileo Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Smart Microsystems |
Organisation | Semefab (Scotland) Ltd |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Smart Microsystems |
Organisation | Wolfson Microelectronics |
Country | United Kingdom |
Sector | Private |
PI Contribution | flagship project |
Start Year | 2010 |
Description | Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture |
Organisation | Chestech |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture |
Organisation | Institute of Circuit Technology |
Country | United Kingdom |
Sector | Charity/Non Profit |
PI Contribution | standard project |
Start Year | 2010 |
Description | Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture |
Organisation | Institute of Metal Finishing |
Country | United Kingdom |
Sector | Charity/Non Profit |
PI Contribution | standard project |
Start Year | 2010 |
Description | Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture |
Organisation | Kelan Cicuits Ltd |
Country | United Kingdom |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture |
Organisation | National Renewable Energy Centre |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture |
Organisation | SP Technical Institute of Sweden |
Country | Sweden |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture |
Organisation | University of Franche-Comté |
Country | France |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture |
Organisation | Whitfield Solar |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | Thermosonic-Adhesive Flip Chip Assembly for Advanced Microelectronic Packaging |
Organisation | Finetech |
Country | Germany |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | Thermosonic-Adhesive Flip Chip Assembly for Advanced Microelectronic Packaging |
Organisation | GE Aviation Systems |
Country | United States |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | Thermosonic-Adhesive Flip Chip Assembly for Advanced Microelectronic Packaging |
Organisation | SONY |
Country | Japan |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | WHISKERMIT |
Organisation | Aero Engine Controls |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | WHISKERMIT |
Organisation | Gen3 Systems |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | WHISKERMIT |
Organisation | MBDA Missile Systems |
Country | United States |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | WHISKERMIT |
Organisation | MacDermid Industrial Solutions |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Description | WHISKERMIT |
Organisation | National Physical Laboratory |
Country | United Kingdom |
Sector | Academic/University |
PI Contribution | standard project |
Start Year | 2010 |
Description | WHISKERMIT |
Organisation | Rolls Royce Group Plc |
Country | United Kingdom |
Sector | Private |
PI Contribution | standard project |
Start Year | 2010 |
Title | ADDITIVE METALLISATION PROCESS |
Description | The invention provides a method of reducing metal ions (3, 204) present on a substrate (100) comprising contacting the metal ions with a material (2, 201, 202) capable of reducing the metal ions to metal atoms (6, 9) upon exposure to visible light, and exposing the material to visible light (1 ) whereby to generate metal atoms from the metal ions. |
IP Reference | WO2012104594 |
Protection | Patent granted |
Year Protection Granted | 2012 |
Licensed | No |
Impact | Unknown |
Title | ELECTRODE ASSEMBLY |
Description | The present invention relates to an electrode assembly having a laminate structure comprising: a first insulating capping layer; a first conducting layer capped by the first insulating capping layer and substantially sandwiched by at least the first insulating capping layer such as to leave exposed only an electrical contact lip of the first conducting layer; and an array of etched voids extending through at least the first insulating capping layer and the first conducting layer, wherein each void is partly bound by a surface of the first conducting layer which acts as an internal submicron electrode. |
IP Reference | WO2010061229 |
Protection | Patent granted |
Year Protection Granted | 2010 |
Licensed | No |
Impact | Unknown |
Title | MICROELECTRODE FOR MOLTEN SALTS |
Description | An electrode, in particular a microelectrode, wherein the surface area (48) of conductor material (44) exposed for use is defined by a covering layer (46) comprising a covalent or an intermediate nitride or mixtures thereof is described. The covering layer (46) may comprise a nitride selected from the group consisting of Si, B, Al, Ga, In, P, Mn,Fe, Co, Ni, Te, Tl and Re nitrides or mixtures thereof. Methods of fabrication of the electrode are also provided. |
IP Reference | WO2014053855 |
Protection | Patent granted |
Year Protection Granted | 2014 |
Licensed | No |
Impact | Unknown |
Title | Printed Electronics |
Description | The patent application has not published as of February 19th 2017. It is due for publication in Q1 2017. Patent arising from "Integration of printed power sources with electronic systems: Rechargeable printed power sources", which involved novel printing technologies for materials build ups to create rechargeable battery structures. Printed Electronics, UK Patent Application Ref: SC/LG6944250 was deemed as not required. International referee number: PCT/EP2016/076857 |
IP Reference | GB1519603.3 |
Protection | Patent application published |
Year Protection Granted | 2017 |
Licensed | No |
Impact | The patent shall shortly be published. An impact acceleration account award has recently been used to investigate potential first technology demonstrators for potential exploitation routes and licensing opportunities. |
Title | Vacuum deposited modification of polymer surfaces |
Description | GB1407956 Vacuum deposited modification of polymer surfaces |
IP Reference | GB1407956.0 |
Protection | Patent application published |
Year Protection Granted | 2014 |
Licensed | No |
Impact | Unknown |
Company Name | Cytomos |
Description | Cytomos is developing technology to enable non-specialist medical practitioners to complete cell analysis without the need to send samples to laboratories. |
Year Established | 2011 |
Impact | Unknown at this time. The company still exists and has 36 shareholders and is still trading though at a loss in the last two years. It continues to receive grant income. |
Website | http://www.cytomos.com |
Company Name | Dynamic Bioarray |
Description | Dynamic Bioarray designs products to be used in micro-analytical systems. |
Year Established | 2012 |
Impact | This company has now ceased trading and is wound up. |
Website | http://www.dynamic-bioarray.com |
Company Name | NanoFlex |
Description | NanoFlex manufactures nano-electrodes on a commercial scale, for uses such as in sensors for diabetic tests and for energy storage. |
Year Established | 2008 |
Impact | The company has created a number of core technologies in nano electrodes and is providing both products and services to the chemical analytics and medical analytics industries. |
Website | http://www.nanoflex.com |
Company Name | Sofant Technologies |
Description | Sofant Technologies develops miniature radio frequency (RF) antennas that can be implanted in mobile devices at the manufacturing stage. |
Year Established | 2011 |
Impact | RF MEMS: Sofant's technology is inherently low cost and can be leveraged to reduce the complexity of RF system design while improving performance and reducing power consumption. Antenna Array: Sofant's ability to leverage its antenna design capability and RF MEMs technology uniquely positions the company to solve the most difficult performance challenges. Software Algorithms: Sofant proprietary algorithms are optimised to extract the maximum performance from its antenna systems. |
Website | http://www.sofant.com |
Description | 1st IeMRC Community meeting |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | Community meeting for the UK electronics manufacturing sector, disseminating KTN activities, Global watch activities all alongside IeMRC funded projects. Plus breakout session to assess the future needs of the sector. Research portfolio definition for upcoming calls for proposals |
Year(s) Of Engagement Activity | 2006 |
URL | http://www.lboro.ac.uk/research/iemrc/community.html |
Description | Beyond solder |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | Promotion of the Centre's work via a workshop on electronics interconnects in collaboration with other interested parties. New research leads made, brokerage for community members |
Year(s) Of Engagement Activity | 2010 |
URL | http://www.lboro.ac.uk/research/iemrc/Events%20write%20up/iMAPS%20uk%20Beyond%20Solder%20Technical%2... |
Description | Developments in interconnection, assembly & packaging |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | In collaboration with TWI Ltd, the IeMRC provided a one day seminar to promote its research and to create opportunity for networking and collaborations. Research dissemination Increased requests for information and contacts to research community |
Year(s) Of Engagement Activity | 2008 |
URL | http://bit.ly/JIi61b |
Description | EPSRC IeMRC Annual Conference |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | Yes |
Type Of Presentation | paper presentation |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | IeMRC annual conference, promoting its funded research alongside invited keynote speakers. Increased awareness of the research field. The event is also primary meeting place for the research community. Led to many additional projects arising from interactions at the event. |
Year(s) Of Engagement Activity | Pre-2006,2006,2007,2008,2009,2010,2011,2012,2013 |
URL | http://www.lboro.ac.uk/research/iemrc/conference.html |
Description | ESTC 2008 |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | Major electronics manufacturing european conference at which IeMRC promoted its activities and funded research, with many contributions from its projects within the various sessions at the conference. Marketing Brand identity Dissemination |
Year(s) Of Engagement Activity | 2008 |
Description | Eco-design for electronics workshop |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | Serving the IeMRC's Sustainability theme, this one day workshop addressed eco-design, with key presentations from IeMRC grantees to 40 delegates. Research agenda setting, input to strategy |
Year(s) Of Engagement Activity | 2007 |
URL | http://www.lboro.ac.uk/research/iemrc/ecodesign.html |
Description | Estimating & Managing Through life costs |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | Collaborative workshop with the IdMRC promoting the joint research with IeMRC. Joint working practices with IDRC Joint proposal with IDRC |
Year(s) Of Engagement Activity | 2008 |
URL | http://www.bath.ac.uk/idmrc/resources/costing/2008-11-12/ |
Description | IC Package Innovation: Choosing the right solution |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | Workshop to provide industrialists with state of the art developments in electronic device packaging. Research dissemination |
Year(s) Of Engagement Activity | 2011 |
URL | http://www.lboro.ac.uk/research/iemrc/documents/EventsDocuments/NMI%2026th%20May%20Choosing%20the%20... |
Description | Imaps microtech conference |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | No |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | The goal of MicroTech, organised by IMAPS-UK was to review the state of the art in System in package. The presentations were from some of the leading experts in the field of micro engineering from science and industry. Dissemination of research Consultation on research agenda Brand identity |
Year(s) Of Engagement Activity | 2006,2008,2010,2012 |
Description | Innovation in Electronics |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | paper presentation |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | Presented the IeMRC and its funded research to a largely industrial audience at an event run by the Electronics KTN. Dissemination Improved brand identity |
Year(s) Of Engagement Activity | 2009 |
Description | Innovative electronics manufacturing seminar |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | The objective of the seminar was to highlight the work being carried out by the IeMRC in universities around the country and to demonstrate its value to the UK electronics Industry. Research dissemination Brand identity formation |
Year(s) Of Engagement Activity | 2007 |
URL | http://www.lboro.ac.uk/research/iemrc/pastevents.html |
Description | Institute of Circuit Technology Annual Symposium |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | keynote/invited speaker |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | Prof Martin Goosey, IeMRC industrial Director, was invited to give the keynote presentation at the ICT's Annual symposium where he gave an overview of the Centre and its activities. Research dissemination of IeMRC activities |
Year(s) Of Engagement Activity | 2007 |
URL | http://www.instct.org/annual-symposium/47-ict-annual-symposium-june-2007-qfuture-trendsq.html |
Description | Intellect PCB supplier group |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | Yes |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | Opportunity to update the PCB supplier group at the trade body INTELLECT with the current status of the Centre's relevant work. Increased exposure of research to target audience Increased industrial collaborations on relevant PCB based research. |
Year(s) Of Engagement Activity | Pre-2006,2006,2007 |
Description | Making MEMS work |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | Workshop on the technical and business challeneges for MEMS manufacturing within the UK, promoting the IeMRC's Flagship project alogside industry presentations. Research dissemination |
Year(s) Of Engagement Activity | 2011 |
Description | NMI Power Electronics Network meeting |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | No |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | NMI's power electronics theme was promoted through a network meeting at which the IeMRC presented its flagship power electronics project and portfolio of research. Invitation to iPower conference Research dissemination |
Year(s) Of Engagement Activity | 2006 |
Description | National Electronics Week Trade Fair |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | Yes |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | Promotion of the IeMRC, its activities and its research portfolio to UK industry. Increased awareness of IeMRC and its research Increased number of industry contacts |
Year(s) Of Engagement Activity | 2008,2009,2010,2011,2012 |
Description | New developments in PCB and interconnect manufacturing |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | Promoting the IeMRC's Flagship research project on optical PCB and interconnects and its PCB surface modification project to a mixed audience of academia and industry, with additional speakers from research & industry. Increased industrial reach for IeMRC Contacts for future collaboration |
Year(s) Of Engagement Activity | 2009 |
URL | http://bit.ly/IeUodw |
Description | Novel electronic materials workshop |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | IeMRC collaborative event with the Centre for advanced functional materials and devices, a centre that is a joint venture between Aberyswyth & Bangor Universities. Increased industrial reach for IeMRC Contacts for future collaboration |
Year(s) Of Engagement Activity | 2009 |
URL | http://bit.ly/IbtJ2v |
Description | Packaging & interconnection for electronics & sensors: Past, present and future |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | A one day workshop organised by the IeMRC in collaboration with the Electronics KTN, TWI Ltd & NMI, promoting the state of the art in packaging research. Research dissemination Input to flagship project activities |
Year(s) Of Engagement Activity | 2010 |
URL | http://bit.ly/IbTSve |
Description | Plastic Electronics: the challenges for low temperature manufacturing |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | Yes |
Type Of Presentation | workshop facilitator |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | Workshop and dissemination event for IeMRC's funded research including the Roll to roll flagship project. Consortia formation for further funding applications and integration with future CIM activities for large area electronics |
Year(s) Of Engagement Activity | 2011 |
URL | http://www.lboro.ac.uk/research/iemrc/Events%20write%20up/PlasticElectronics150311_IeMRC.pdf |
Description | Plating technology |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | workshop facilitator |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | In collaboration with the Institute of Circuit Technology, the IeMRC provided a seminar on the topic of plating technology within the printed circuit board sector, including the promotion of one of the IeMRC's funded projects. Dissemination of research to industrial audience |
Year(s) Of Engagement Activity | 2008 |
URL | http://bit.ly/IPjhdV |
Description | Power Electronics |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | Yes |
Type Of Presentation | paper presentation |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | One day seminar covering the topic of power electronics, run in collaboration with Electronics Yorkshire. Industry networking Input to power electronics community strategy |
Year(s) Of Engagement Activity | 2009 |
URL | http://www.lboro.ac.uk/research/iemrc/Powerelectronicsseminar.html |
Description | Printed & plastic electronics seminar |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | Yes |
Type Of Presentation | workshop facilitator |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | Seminar promoting the IeMRC's flagship project on printed electronics alongside industry and academic presentations. Increased industrial reach for IeMRC Contacts for future collaboration |
Year(s) Of Engagement Activity | 2012 |
URL | http://www.lboro.ac.uk/research/iemrc/documents/EventsDocuments/19thMarch2012%20Printed%20and%20Plas... |
Description | Printed electronics - technologies and applications |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | Yes |
Type Of Presentation | workshop facilitator |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | Co-organisers of afternoon networking event promoting IeMRC printed electronics research. Increased industrial reach for IeMRC Contacts for future collaboration |
Year(s) Of Engagement Activity | 2010 |
Description | Productronica Trade Fairs |
Form Of Engagement Activity | A talk or presentation |
Part Of Official Scheme? | No |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | Largest European trade exhibition for electronics manufacturing, where the IeMRC promoted its research. New linkages ot FhG institutes and European trade organisations, e.g. EIPC. |
Year(s) Of Engagement Activity | 2007,2009,2011,2013 |
Description | SUMEEPnet scientific conference |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | paper presentation |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | Dissemination event for the EPSRC funded sustainability network grant SUMEEPnet, and IeMRC funded research. Integration of two research communities Research exchanges |
Year(s) Of Engagement Activity | 2008 |
URL | http://www.lboro.ac.uk/research/iemrc/Sustainable%20Electronics%20Manufacture%20wkshop.html |
Description | Sustain 07 |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | paper presentation |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | 5th international conference on design and manufacture for sustainable development provided an opportunity for the IeMRC to disseminate its funded research on the theme of sustainability. Increased enquiries for information and contacts |
Year(s) Of Engagement Activity | 2007 |
Description | System in package workshop |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | No |
Type Of Presentation | paper presentation |
Geographic Reach | National |
Primary Audience | Professional Practitioners |
Results and Impact | Promotion of IeMRC funded work on system in package alongside that taking place in industry and research organisations. Industrial seminar series Informed IeMRC project |
Year(s) Of Engagement Activity | 2007 |
URL | http://www.lboro.ac.uk/research/iemrc/SiPwkshop2007.html |
Description | Webinar ITRI |
Form Of Engagement Activity | Participation in an activity, workshop or similar |
Part Of Official Scheme? | No |
Geographic Reach | National |
Primary Audience | Industry/Business |
Results and Impact | HASLEN: An obituary to Blackpad webinar hosted with ITRI |
Year(s) Of Engagement Activity | 2014 |
Description | Workshop |
Form Of Engagement Activity | Participation in an activity, workshop or similar |
Part Of Official Scheme? | No |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | Organised by Heriot-Watt University and Loughborough University the event was fulfilled with various academics interested on the field of biomimetics and biomaterials including talks from Prof. Julian Vincent , Dr. Nikolay Bogatyrev , Prof. Mateo Santin and Dr. Benjamin Felbrich . Among participants where experts from leading institutions such as University of Edinburgh, Brunel University, University College London, University of Cambridge and University of Dundee . The main topics discussed where the current situation of bio-inspired design, biomaterial properties and structure, potential methodologies and processes to implement in manufacturing. |
Year(s) Of Engagement Activity | 2014,2015 |
URL | http://www.biomimicry-uk.org/first-steps-in-the-creation-of-a-naturally-inspired-manufacturing-centr... |
Description | iPower |
Form Of Engagement Activity | A formal working group, expert panel or dialogue |
Part Of Official Scheme? | Yes |
Type Of Presentation | paper presentation |
Geographic Reach | International |
Primary Audience | Professional Practitioners |
Results and Impact | 2 day power electronics conference focussing on the UK's strengths in this area. Networking and dissemination |
Year(s) Of Engagement Activity | 2011 |