An Innovative Electronics Manufacturing Research Centre

Lead Research Organisation: Loughborough University
Department Name: Sch of Mechanical and Manufacturing Eng

Abstract

The IeMRC is one of 16 Innovative Manufacturing Research Centres (IMRCs) set up and supported by the Engineering and Physical Sciences Research Council (EPSRC), focussing on the electronics manufacturing sector.With more than 5 million funding over 5 years (2004-2009), the IeMRC is distributed among a number of universities and has a 'hub' at Loughborough, UK. Other UK universities involved in the operation of the Centre include Bath, Brunel, Greenwich, Lancaster, Heriot-Watt and Nottingham. This is a proposal to renew the IeMRC for a further 5 years, from March 2010.Compared with the other Innovative Manufacturing Centres established with EPSRC support, the IeMRC differs in being a distributed research operation rather than having a fixed location for its research activities. Universities across the UK are able to bid for funds from the Centre, so encouraging open collaboration between groups. The advantage of a distributed programme, compared with a single centre, is that it allows the most appropriate people to do the work for an industry that has now become very diverse.Key elements of the IeMRC are the high level of industrial involvement and strong industrial steering group that decides priorities for funding. As with other IMRCs, the contribution from industry in resources and cash will at least match the EPSRC funds.

Planned Impact

Please see attached covering letter.

Organisations

 
Description The IeMRC was a national manufacturing centre award that funded 22 universities addressing challenges in electronics manufacturing, ranging from new materials development, manufacturing processes and technologies to design methodologies and end of life and sustainability issues.
Exploitation Route A multitude of routes forward for the 40+ research projects funded by the centre. Some licenses, spin outs, technology transfer via KTPs and transfer of people and graduating PhD students.
Sectors Aerospace, Defence and Marine,Communities and Social Services/Policy,Digital/Communication/Information Technologies (including Software),Electronics,Energy,Environment,Healthcare,Manufacturing, including Industrial Biotechology,Transport

URL http://www.lboro.ac.uk/microsites/research/iemrc/
 
Description EPSRC Centre for Doctoral Training in Embedded Intelligence
Amount £3,567,115 (GBP)
Funding ID EP/L014998/1 
Organisation Engineering and Physical Sciences Research Council (EPSRC) 
Sector Academic/University
Country United Kingdom
Start 02/2014 
End 10/2022
 
Description EPSRC Impact Accelerator Account Follow-on Funding
Amount £25,000 (GBP)
Organisation Engineering and Physical Sciences Research Council (EPSRC) 
Sector Academic/University
Country United Kingdom
Start  
 
Description Knowledge Transfer partnership
Amount £118,000 (GBP)
Funding ID KTP Project No 9559 
Organisation Innovate UK 
Sector Public
Country United Kingdom
Start  
 
Description 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed RFMEMS Components 
Organisation Antenova M2M
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed RFMEMS Components 
Organisation EADS Astrium
Country France 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed RFMEMS Components 
Organisation Plextek
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed RFMEMS Components 
Organisation Ultra Electronics
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description 3D Microwave & Millimetre-Wave System-on-Substrate using Sacrificial Layers for Printed RFMEMS Components 
Organisation e2v Technologies
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Carbon Nano Tube (CNT) Composite Surfaces for Electrical Contact Interfaces 
Organisation C-MAC
Country Belgium 
Sector Private 
PI Contribution standard project
Start Year 2011
 
Description Carbon Nano Tube (CNT) Composite Surfaces for Electrical Contact Interfaces 
Organisation Micro-Materials Ltd.
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2011
 
Description Carbon Nano Tube (CNT) Composite Surfaces for Electrical Contact Interfaces 
Organisation National Physical Laboratory
Country United Kingdom 
Sector Academic/University 
PI Contribution standard project
Start Year 2011
 
Description Carbon Nano Tube (CNT) Composite Surfaces for Electrical Contact Interfaces 
Organisation TaiCaan Technologies Ltd
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2011
 
Description Conductive Resists for Nanofabrication on Insulating Substrates 
Organisation Chestech
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Conductive Resists for Nanofabrication on Insulating Substrates 
Organisation EM Systems Support
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Conductive Resists for Nanofabrication on Insulating Substrates 
Organisation INEX Microtechnology
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Conductive Resists for Nanofabrication on Insulating Substrates 
Organisation IQE Europe Limited
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Conductive Resists for Nanofabrication on Insulating Substrates 
Organisation Oxford Instruments
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Conductive Resists for Nanofabrication on Insulating Substrates 
Organisation Precision Micro
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Conductive Resists for Nanofabrication on Insulating Substrates 
Organisation RFMD (UK)
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Conductive Resists for Nanofabrication on Insulating Substrates 
Organisation Vistec
Country Germany 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Costing for Avionic Through-Life Availability (CATA) 
Organisation BAE Systems
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Costing for Avionic Through-Life Availability (CATA) 
Organisation BAE Systems
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Costing for Avionic Through-Life Availability (CATA) 
Organisation GE Aviation Systems
Country United States 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Costing for Avionic Through-Life Availability (CATA) 
Organisation Georgia Institute of Technology
Country United States 
Sector Academic/University 
PI Contribution standard project
Start Year 2010
 
Description Costing for Avionic Through-Life Availability (CATA) 
Organisation Ministry of Defence (MOD)
Department Defence Equipment and Support
Country United Kingdom 
Sector Public 
PI Contribution standard project
Start Year 2010
 
Description Costing for Avionic Through-Life Availability (CATA) 
Organisation University of Bath
Department Innovative Design & Manufacturing Research Centre (IDMRC)
Country United Kingdom 
Sector Academic/University 
PI Contribution standard project
Start Year 2010
 
Description Costing for Avionic Through-Life Availability (CATA) 
Organisation University of Maryland
Department Centre for Advanced Life Cycle Engineering (CALCE)
Country United States 
Sector Academic/University 
PI Contribution standard project
Start Year 2010
 
Description Costing for Avionic Through-Life Availability (CATA) 
Organisation University of the West of England
Country United Kingdom 
Sector Academic/University 
PI Contribution standard project
Start Year 2010
 
Description Design for increased yield 
Organisation Accelonix
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2011
 
Description Design for increased yield 
Organisation Airborne Environmental Consultants (AEC)
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2011
 
Description Design for increased yield 
Organisation General Electric
Country United States 
Sector Private 
PI Contribution standard project
Start Year 2011
 
Description Design for increased yield 
Organisation Invotec Group Ltd
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2011
 
Description Design for increased yield 
Organisation Selex ES
Department SELEX Elsag Ltd
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2011
 
Description Design for increased yield 
Organisation TWI The Welding Institue
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2011
 
Description Electrochemically assisted integration of organic semiconductors on CMOS and MEMS 
Organisation Semefab (Scotland) Ltd
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Electrochemically assisted integration of organic semiconductors on CMOS and MEMS 
Organisation University of Edinburgh
Department Scottish Microelectronics Centre
Country United Kingdom 
Sector Academic/University 
PI Contribution standard project
Start Year 2010
 
Description Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing 
Organisation Chestech
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing 
Organisation Graphic Circuits
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing 
Organisation Institute of Circuit Technology
Country United Kingdom 
Sector Charity/Non Profit 
PI Contribution standard project
Start Year 2012
 
Description Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing 
Organisation Intrinsiq Materials Ltd
Country United States 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Functionalisation of Copper Nanoparticles to enable Metallisation in Electronics Manufacturing 
Organisation Printed Electronics Ltd
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description High Performance Flexible, Fabric Electronics for MegaHertz Frequency Communication 
Organisation Advanced Therapeutic Materials
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description High Performance Flexible, Fabric Electronics for MegaHertz Frequency Communication 
Organisation Antrum
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description High Performance Flexible, Fabric Electronics for MegaHertz Frequency Communication 
Organisation Signature Industries Limited - SABRE
Country United States 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description High-performance low-cost power modules for energy smart network applications 
Organisation Areva
Country France 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description High-performance low-cost power modules for energy smart network applications 
Organisation CRDM
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description High-performance low-cost power modules for energy smart network applications 
Organisation Dynex Semiconductor
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Micro-interconnects Using Mono-sized Polymer Microspheresfor Large Format High Resolution Sensor Packaging 
Organisation Conpart
Country Norway 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Micro-interconnects Using Mono-sized Polymer Microspheresfor Large Format High Resolution Sensor Packaging 
Organisation National Physical Laboratory
Country United Kingdom 
Sector Academic/University 
PI Contribution standard project
Start Year 2010
 
Description Micro-interconnects Using Mono-sized Polymer Microspheresfor Large Format High Resolution Sensor Packaging 
Organisation Rutherford Appleton Laboratory
Country United Kingdom 
Sector Public 
PI Contribution standard project
Start Year 2010
 
Description Robustness Design and Health Management in Power Electronics using Damage Mechanics-Based Models (RODENT) 
Organisation Alstom
Department Alstom Grid
Country France 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Robustness Design and Health Management in Power Electronics using Damage Mechanics-Based Models (RODENT) 
Organisation Dynex Semiconductor
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Robustness Design and Health Management in Power Electronics using Damage Mechanics-Based Models (RODENT) 
Organisation GE Power & Conversion
Department Converteam UK
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Robustness Design and Health Management in Power Electronics using Damage Mechanics-Based Models (RODENT) 
Organisation TT-electronics Semelab
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) 
Organisation Axess Technologies
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) 
Organisation Camvac Ltd
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) 
Organisation Dalmatian Technology
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) 
Organisation DuPont Teijin Films
Country Global 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) 
Organisation General Vacuum Equipment
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) 
Organisation Nampak Healthcare
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) 
Organisation Parkside Hospital
Country United Kingdom 
Sector Hospitals 
PI Contribution flagship project
Start Year 2010
 
Description Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) 
Organisation Procter & Gamble
Country United States 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) 
Organisation Scott Bader Co Ltd
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Roll-to-roll Vacuum processed Carbon Based Electronics (RoVaCBE) 
Organisation Silvaco, Inc
Department Silvaco Europe Ltd
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description SUSTAINING ELECTRONIC INDUSTRY THROUGH MANAGING UNCERTAINTY IN CONTRACT BIDDING 
Organisation BAE Systems
Department BAE Systems Australia
Country Australia 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description SUSTAINING ELECTRONIC INDUSTRY THROUGH MANAGING UNCERTAINTY IN CONTRACT BIDDING 
Organisation BAE Systems
Department BAE Systems Maritime – Naval Ships
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description SUSTAINING ELECTRONIC INDUSTRY THROUGH MANAGING UNCERTAINTY IN CONTRACT BIDDING 
Organisation BAE Systems
Department BAE Systems Military Air & Information
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description SUSTAINING ELECTRONIC INDUSTRY THROUGH MANAGING UNCERTAINTY IN CONTRACT BIDDING 
Organisation Rolls Royce Group Plc
Department Rolls Royce Submarines
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2012
 
Description Smart Microsystems 
Organisation Ceimig
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Smart Microsystems 
Organisation Memsstar (Point 35 Microstructures)
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Smart Microsystems 
Organisation National Semiconductor
Country United States 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Smart Microsystems 
Organisation Pyreos
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Smart Microsystems 
Organisation Qinetiq
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Smart Microsystems 
Organisation Renishaw PLC
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Smart Microsystems 
Organisation ST Microelectronics
Country Switzerland 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Smart Microsystems 
Organisation Selex ES
Department SELEX Galileo Ltd
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Smart Microsystems 
Organisation Semefab (Scotland) Ltd
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Smart Microsystems 
Organisation Wolfson Microelectronics
Country United Kingdom 
Sector Private 
PI Contribution flagship project
Start Year 2010
 
Description Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture 
Organisation Chestech
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture 
Organisation Institute of Circuit Technology
Country United Kingdom 
Sector Charity/Non Profit 
PI Contribution standard project
Start Year 2010
 
Description Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture 
Organisation Institute of Metal Finishing
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture 
Organisation Kelan Cicuits Ltd
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture 
Organisation National Renewable Energy Centre
Country United Kingdom 
Sector Charity/Non Profit 
PI Contribution standard project
Start Year 2010
 
Description Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture 
Organisation SP Technical Institute of Sweden
Country Sweden 
Sector Academic/University 
PI Contribution standard project
Start Year 2010
 
Description Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture 
Organisation University of Franche-Comté
Country France 
Sector Academic/University 
PI Contribution standard project
Start Year 2010
 
Description Sustainable Ultrasonic Electroless and Immersion Plating Processes for Photovoltaicand Printed Circuit Board Manufacture 
Organisation Whitfield Solar
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Thermosonic-Adhesive Flip Chip Assembly for Advanced Microelectronic Packaging 
Organisation Finetech
Country Germany 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Thermosonic-Adhesive Flip Chip Assembly for Advanced Microelectronic Packaging 
Organisation GE Aviation Systems
Country United States 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description Thermosonic-Adhesive Flip Chip Assembly for Advanced Microelectronic Packaging 
Organisation SONY
Country Japan 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description WHISKERMIT 
Organisation Aero Engine Controls
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description WHISKERMIT 
Organisation Gen3 Systems
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description WHISKERMIT 
Organisation MBDA Missile Systems
Country United States 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description WHISKERMIT 
Organisation MacDermid Industrial Solutions
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Description WHISKERMIT 
Organisation National Physical Laboratory
Country United Kingdom 
Sector Academic/University 
PI Contribution standard project
Start Year 2010
 
Description WHISKERMIT 
Organisation Rolls Royce Group Plc
Country United Kingdom 
Sector Private 
PI Contribution standard project
Start Year 2010
 
Title ADDITIVE METALLISATION PROCESS 
Description The invention provides a method of reducing metal ions (3, 204) present on a substrate (100) comprising contacting the metal ions with a material (2, 201, 202) capable of reducing the metal ions to metal atoms (6, 9) upon exposure to visible light, and exposing the material to visible light (1 ) whereby to generate metal atoms from the metal ions. 
IP Reference WO2012104594 
Protection Patent granted
Year Protection Granted 2012
Licensed No
Impact Unknown
 
Title ELECTRODE ASSEMBLY 
Description The present invention relates to an electrode assembly having a laminate structure comprising: a first insulating capping layer; a first conducting layer capped by the first insulating capping layer and substantially sandwiched by at least the first insulating capping layer such as to leave exposed only an electrical contact lip of the first conducting layer; and an array of etched voids extending through at least the first insulating capping layer and the first conducting layer, wherein each void is partly bound by a surface of the first conducting layer which acts as an internal submicron electrode. 
IP Reference WO2010061229 
Protection Patent granted
Year Protection Granted 2010
Licensed No
Impact Unknown
 
Title MICROELECTRODE FOR MOLTEN SALTS 
Description An electrode, in particular a microelectrode, wherein the surface area (48) of conductor material (44) exposed for use is defined by a covering layer (46) comprising a covalent or an intermediate nitride or mixtures thereof is described. The covering layer (46) may comprise a nitride selected from the group consisting of Si, B, Al, Ga, In, P, Mn,Fe, Co, Ni, Te, Tl and Re nitrides or mixtures thereof. Methods of fabrication of the electrode are also provided. 
IP Reference WO2014053855 
Protection Patent granted
Year Protection Granted 2014
Licensed No
Impact Unknown
 
Title Printed Electronics 
Description The patent application has not published as of February 19th 2017. It is due for publication in Q1 2017. Patent arising from "Integration of printed power sources with electronic systems: Rechargeable printed power sources", which involved novel printing technologies for materials build ups to create rechargeable battery structures. Printed Electronics, UK Patent Application Ref: SC/LG6944250 was deemed as not required. International referee number: PCT/EP2016/076857 
IP Reference GB1519603.3 
Protection Patent application published
Year Protection Granted 2017
Licensed No
Impact The patent shall shortly be published. An impact acceleration account award has recently been used to investigate potential first technology demonstrators for potential exploitation routes and licensing opportunities.
 
Title Vacuum deposited modification of polymer surfaces 
Description GB1407956 Vacuum deposited modification of polymer surfaces 
IP Reference GB1407956 
Protection Patent application published
Year Protection Granted 2014
Licensed No
Impact Unknown
 
Company Name Cytomos Ltd 
Description Manufacture of electronic measuring, testing etc. equipment, not for industrial process control 
Year Established 2011 
Impact Unknown at this time. The company still exists and has 36 shareholders and is still trading though at a loss in the last two years. It continues to receive grant income.
Website https://www.cytomos.com
 
Company Name Nanoflex Ltd 
Description NanoFlex designs and manufactures high performance electrodes suitable for use in sensors in a range of electroanalytical applications, typically in the healthcare and wearable technology sectors. Our electrodes are able to push the limits of detection provided by traditional electrochemical technologies by between 100 to 1000 times, thus providing an ultra-sensitive detection platform compatible with existing technologies. 
Year Established 2008 
Impact The company has created a number of core technologies in nano electrodes and is providing both products and services to the chemical analytics and medical analytics industries.
Website http://www.nanoflex.com
 
Company Name Sofant Technologies 
Description Sofant Technologies Ltd is a highly innovative technology company which was incorporated in 2011 to commercialize researched and developed work which began at the University of Edinburgh in 2006. Sofant's inherently low cost, low power and high performance smart antenna™ technology is being applied to develop innovative solutions which help its customers reduce the cost and complexity of leading edge RF system design. 
Year Established 2011 
Impact RF MEMS: Sofant's technology is inherently low cost and can be leveraged to reduce the complexity of RF system design while improving performance and reducing power consumption. Antenna Array: Sofant's ability to leverage its antenna design capability and RF MEMs technology uniquely positions the company to solve the most difficult performance challenges. Software Algorithms: Sofant proprietary algorithms are optimised to extract the maximum performance from its antenna systems.
Website http://www.sofant.com
 
Company Name Dynamic Bioarray 
Description research and experimental development on natural sciences and engineering 
Year Established 2012 
Impact This company has now ceased trading and is wound up.
 
Description 1st IeMRC Community meeting 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact Community meeting for the UK electronics manufacturing sector, disseminating KTN activities, Global watch activities all alongside IeMRC funded projects. Plus breakout session to assess the future needs of the sector.

Research portfolio definition for upcoming calls for proposals
Year(s) Of Engagement Activity 2006
URL http://www.lboro.ac.uk/research/iemrc/community.html
 
Description Beyond solder 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact Promotion of the Centre's work via a workshop on electronics interconnects in collaboration with other interested parties.

New research leads made, brokerage for community members
Year(s) Of Engagement Activity 2010
URL http://www.lboro.ac.uk/research/iemrc/Events%20write%20up/iMAPS%20uk%20Beyond%20Solder%20Technical%2...
 
Description Developments in interconnection, assembly & packaging 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact In collaboration with TWI Ltd, the IeMRC provided a one day seminar to promote its research and to create opportunity for networking and collaborations.

Research dissemination
Increased requests for information and contacts to research community
Year(s) Of Engagement Activity 2008
URL http://bit.ly/JIi61b
 
Description EPSRC IeMRC Annual Conference 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? Yes
Type Of Presentation paper presentation
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact IeMRC annual conference, promoting its funded research alongside invited keynote speakers.

Increased awareness of the research field.
The event is also primary meeting place for the research community. Led to many additional projects arising from interactions at the event.
Year(s) Of Engagement Activity Pre-2006,2006,2007,2008,
URL http://www.lboro.ac.uk/research/iemrc/conference.html
 
Description ESTC 2008 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact Major electronics manufacturing european conference at which IeMRC promoted its activities and funded research, with many contributions from its projects within the various sessions at the conference.

Marketing
Brand identity
Dissemination
Year(s) Of Engagement Activity 2008
 
Description Eco-design for electronics workshop 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact Serving the IeMRC's Sustainability theme, this one day workshop addressed eco-design, with key presentations from IeMRC grantees to 40 delegates.

Research agenda setting, input to strategy
Year(s) Of Engagement Activity 2007
URL http://www.lboro.ac.uk/research/iemrc/ecodesign.html
 
Description Estimating & Managing Through life costs 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact Collaborative workshop with the IdMRC promoting the joint research with IeMRC.

Joint working practices with IDRC
Joint proposal with IDRC
Year(s) Of Engagement Activity 2008
URL http://www.bath.ac.uk/idmrc/resources/costing/2008-11-12/
 
Description IC Package Innovation: Choosing the right solution 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact Workshop to provide industrialists with state of the art developments in electronic device packaging.

Research dissemination
Year(s) Of Engagement Activity 2011
URL http://www.lboro.ac.uk/research/iemrc/documents/EventsDocuments/NMI%2026th%20May%20Choosing%20the%20...
 
Description Imaps microtech conference 
Form Of Engagement Activity A talk or presentation
Part Of Official Scheme? No
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact The goal of MicroTech, organised by IMAPS-UK was to review the state of the art in System in package. The presentations were from some of the leading experts in the field of micro engineering from science and industry.

Dissemination of research
Consultation on research agenda
Brand identity
Year(s) Of Engagement Activity 2006,2008,2010,2012
 
Description Innovation in Electronics 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation paper presentation
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact Presented the IeMRC and its funded research to a largely industrial audience at an event run by the Electronics KTN.

Dissemination
Improved brand identity
Year(s) Of Engagement Activity 2009
 
Description Innovative electronics manufacturing seminar 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact The objective of the seminar was to highlight the work being carried out by the IeMRC in universities around the country and to demonstrate its value to the UK electronics Industry.

Research dissemination
Brand identity formation
Year(s) Of Engagement Activity 2007
URL http://www.lboro.ac.uk/research/iemrc/pastevents.html
 
Description Institute of Circuit Technology Annual Symposium 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation keynote/invited speaker
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact Prof Martin Goosey, IeMRC industrial Director, was invited to give the keynote presentation at the ICT's Annual symposium where he gave an overview of the Centre and its activities.

Research dissemination of IeMRC activities
Year(s) Of Engagement Activity 2007
URL http://www.instct.org/annual-symposium/47-ict-annual-symposium-june-2007-qfuture-trendsq.html
 
Description Intellect PCB supplier group 
Form Of Engagement Activity A talk or presentation
Part Of Official Scheme? Yes
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact Opportunity to update the PCB supplier group at the trade body INTELLECT with the current status of the Centre's relevant work.

Increased exposure of research to target audience
Increased industrial collaborations on relevant PCB based research.
Year(s) Of Engagement Activity Pre-2006,2006,2007
 
Description Making MEMS work 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact Workshop on the technical and business challeneges for MEMS manufacturing within the UK, promoting the IeMRC's Flagship project alogside industry presentations.

Research dissemination
Year(s) Of Engagement Activity 2011
 
Description NMI Power Electronics Network meeting 
Form Of Engagement Activity A talk or presentation
Part Of Official Scheme? No
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact NMI's power electronics theme was promoted through a network meeting at which the IeMRC presented its flagship power electronics project and portfolio of research.

Invitation to iPower conference
Research dissemination
Year(s) Of Engagement Activity 2006
 
Description National Electronics Week Trade Fair 
Form Of Engagement Activity A talk or presentation
Part Of Official Scheme? Yes
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact Promotion of the IeMRC, its activities and its research portfolio to UK industry.

Increased awareness of IeMRC and its research
Increased number of industry contacts
Year(s) Of Engagement Activity 2008,2009,2010,2011,2012
 
Description New developments in PCB and interconnect manufacturing 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact Promoting the IeMRC's Flagship research project on optical PCB and interconnects and its PCB surface modification project to a mixed audience of academia and industry, with additional speakers from research & industry.

Increased industrial reach for IeMRC
Contacts for future collaboration
Year(s) Of Engagement Activity 2009
URL http://bit.ly/IeUodw
 
Description Novel electronic materials workshop 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact IeMRC collaborative event with the Centre for advanced functional materials and devices, a centre that is a joint venture between Aberyswyth & Bangor Universities.

Increased industrial reach for IeMRC
Contacts for future collaboration
Year(s) Of Engagement Activity 2009
URL http://bit.ly/IbtJ2v
 
Description Packaging & interconnection for electronics & sensors: Past, present and future 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact A one day workshop organised by the IeMRC in collaboration with the Electronics KTN, TWI Ltd & NMI, promoting the state of the art in packaging research.

Research dissemination
Input to flagship project activities
Year(s) Of Engagement Activity 2010
URL http://bit.ly/IbTSve
 
Description Plastic Electronics: the challenges for low temperature manufacturing 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? Yes
Type Of Presentation workshop facilitator
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact Workshop and dissemination event for IeMRC's funded research including the Roll to roll flagship project.

Consortia formation for further funding applications and integration with future CIM activities for large area electronics
Year(s) Of Engagement Activity 2011
URL http://www.lboro.ac.uk/research/iemrc/Events%20write%20up/PlasticElectronics150311_IeMRC.pdf
 
Description Plating technology 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation workshop facilitator
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact In collaboration with the Institute of Circuit Technology, the IeMRC provided a seminar on the topic of plating technology within the printed circuit board sector, including the promotion of one of the IeMRC's funded projects.

Dissemination of research to industrial audience
Year(s) Of Engagement Activity 2008
URL http://bit.ly/IPjhdV
 
Description Power Electronics 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? Yes
Type Of Presentation paper presentation
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact One day seminar covering the topic of power electronics, run in collaboration with Electronics Yorkshire.

Industry networking
Input to power electronics community strategy
Year(s) Of Engagement Activity 2009
URL http://www.lboro.ac.uk/research/iemrc/Powerelectronicsseminar.html
 
Description Printed & plastic electronics seminar 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? Yes
Type Of Presentation workshop facilitator
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact Seminar promoting the IeMRC's flagship project on printed electronics alongside industry and academic presentations.

Increased industrial reach for IeMRC
Contacts for future collaboration
Year(s) Of Engagement Activity 2012
URL http://www.lboro.ac.uk/research/iemrc/documents/EventsDocuments/19thMarch2012%20Printed%20and%20Plas...
 
Description Printed electronics - technologies and applications 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? Yes
Type Of Presentation workshop facilitator
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact Co-organisers of afternoon networking event promoting IeMRC printed electronics research.

Increased industrial reach for IeMRC
Contacts for future collaboration
Year(s) Of Engagement Activity 2010
 
Description Productronica Trade Fairs 
Form Of Engagement Activity A talk or presentation
Part Of Official Scheme? No
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact Largest European trade exhibition for electronics manufacturing, where the IeMRC promoted its research.

New linkages ot FhG institutes and European trade organisations, e.g. EIPC.
Year(s) Of Engagement Activity 2007,2009,2011,2013
 
Description SUMEEPnet scientific conference 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation paper presentation
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact Dissemination event for the EPSRC funded sustainability network grant SUMEEPnet, and IeMRC funded research.

Integration of two research communities
Research exchanges
Year(s) Of Engagement Activity 2008
URL http://www.lboro.ac.uk/research/iemrc/Sustainable%20Electronics%20Manufacture%20wkshop.html
 
Description Sustain 07 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation paper presentation
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact 5th international conference on design and manufacture for sustainable development provided an opportunity for the IeMRC to disseminate its funded research on the theme of sustainability.

Increased enquiries for information and contacts
Year(s) Of Engagement Activity 2007
 
Description System in package workshop 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? No
Type Of Presentation paper presentation
Geographic Reach National
Primary Audience Professional Practitioners
Results and Impact Promotion of IeMRC funded work on system in package alongside that taking place in industry and research organisations.

Industrial seminar series
Informed IeMRC project
Year(s) Of Engagement Activity 2007
URL http://www.lboro.ac.uk/research/iemrc/SiPwkshop2007.html
 
Description Webinar ITRI 
Form Of Engagement Activity Participation in an activity, workshop or similar
Part Of Official Scheme? No
Geographic Reach National
Primary Audience Industry/Business
Results and Impact HASLEN: An obituary to Blackpad webinar hosted with ITRI
Year(s) Of Engagement Activity 2014
 
Description Workshop 
Form Of Engagement Activity Participation in an activity, workshop or similar
Part Of Official Scheme? No
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact Organised by Heriot-Watt University and Loughborough University the event was fulfilled with various academics interested on the field of biomimetics and biomaterials including talks from Prof. Julian Vincent , Dr. Nikolay Bogatyrev , Prof. Mateo Santin and Dr. Benjamin Felbrich . Among participants where experts from leading institutions such as University of Edinburgh, Brunel University, University College London, University of Cambridge and University of Dundee .

The main topics discussed where the current situation of bio-inspired design, biomaterial properties and structure, potential methodologies and processes to implement in manufacturing.
Year(s) Of Engagement Activity 2014,2015
URL http://www.biomimicry-uk.org/first-steps-in-the-creation-of-a-naturally-inspired-manufacturing-centr...
 
Description iPower 
Form Of Engagement Activity A formal working group, expert panel or dialogue
Part Of Official Scheme? Yes
Type Of Presentation paper presentation
Geographic Reach International
Primary Audience Professional Practitioners
Results and Impact 2 day power electronics conference focussing on the UK's strengths in this area.

Networking and dissemination
Year(s) Of Engagement Activity 2011