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New Design and Manufacture Technologies for High-Performance Millimetre-Wave and Terahertz Waveguide Devices for Space and Terrestrial Communications

Lead Research Organisation: University of Birmingham
Department Name: Electronic, Electrical and Computer Eng

Abstract

This project aims to explore novel design methodologies and implementation techniques for high-performance mm-wave and terahertz waveguide devices for space and terrestrial applications in the next generation 5G/6G communications. Microwave filter design has become an establish art. However, as frequency goes higher into millimetre-wave and terahertz regime, filter design faces a whole new set of challenges from improving the insertion loss, to reducing the dimensional sensitivity and therefore increasing the manufacture yield. This not only challenges microwave designer but also the manufacture techniques. To meet the demands of future space and satellite communications for 5G, 6G and beyond, which will feature millimeter-wave and terahertz regions, there is a need for a general and novel design methodology to synthesize and manufacture the waveguide filters and filtering components by exploring new and advanced machining techniques. The goal is to achieve filters with high unloaded quality factor, low insertion loss, high selectivity, low sensitivity, low geometrical complexity, high power handling capacity, and high fabrication tolerance. First, a new
and general methodology for synthesizing inline elliptic-function filters using a modular approach based on novel resonator sections will be presented. Then, Novel solutions with new topologies and resonator structures will be proposed and experimentally verified to demonstrate low-loss and desensitization to manufacture tolerance in the modeling and implementation step. Finally, based on the methodology and strategy, fabrication and demonstration of the waveguide components using advanced 3-D printing and micromachining techniques will be completed, by a Design-for-Manufacture (DFM) approach.

Publications

10 25 50
 
Title Design methodology of through glass via-based IPD filter 
Description 1. Modeling and Optimization of Non-Uniform TGV Structures? Three-dimensional electromagnetic models of non-uniform Through-Glass Vias (TGVs) are established to analyze signal transmission characteristics (e.g., impedance matching, parasitic capacitance/inductance). Multi-objective optimization algorithms are applied to adjust geometric parameters (aperture, pitch) for minimizing signal delay and loss?. 2?. Material-Process Co-Design? Low-loss dielectric materials are selected based on glass substrate properties, and surface treatments (e.g., foam coating) are implemented to enhance high-frequency performance. Compatibility with semiconductor fabrication processes (photolithography, metal deposition) ensures precision integration. 
Type Of Material Improvements to research infrastructure 
Year Produced 2025 
Provided To Others? No  
Impact I?t has three main impacts: 1. Multiphysics Simulation Platform Enhancement? Specialized simulation tools based on electromagnetic-thermal-mechanical coupling models of non-uniform TGVs are developed to enable rapid iterative verification of complex 3D structures, reducing experimental costs and shortening development cycles. 2?. High-Precision Manufacturing Process Improvement? Submicron-scale TGV via processing is further developed, while in-situ defect detection systems ensure real-time monitoring of manufacturing consistency and reliability. 3?. Interdisciplinary Technology Integration? Migration of wavelength tuning methods from optical filters to the RF domain drives the development of reconfigurable filters, expanding research boundaries in high-frequency communications and radar application. 
 
Description Collaboration with Mm-wave device group at RAL Space 
Organisation Rutherford Appleton Laboratory
Department RAL Space
Country United Kingdom 
Sector Academic/University 
PI Contribution Filter design expertise for the development of filters and multipelxers for earth observation instruments
Collaborator Contribution Expertise in instrumentation; knowhow and facility for high precision manufacturing
Impact Several joint publications; Joint research grants
Start Year 2018
 
Title On-chip TGV-based filter product 
Description Combined with the advanced TGV process to design IPD filters, we aim to launch a series of TGV-based filter products featured with: 1. ?High-Frequency Performance and Stability? ?High Q-factor (>500)? and ?low insertion loss (<0.5 dB)? enable efficient signal transmission in 5G/6G millimeter-wave communication systems, with ?stopband rejection exceeding 40 dB? to suppress interference?. 2. ?Process Compatibility and Integration? Seamless integration with semiconductor fabrication processes (e.g., photolithography, plasma-enhanced chemical vapor deposition) supports ?sub-micron via metallization? (copper fill rate >98%) for 3D heterogeneous integration?. 3. ?Cost Efficiency and Reliability? Lower manufacturing costs compared to traditional ceramic substrates, with ?production yield exceeding 95%? for large-scale applications?. 
Type Of Technology New/Improved Technique/Technology 
Year Produced 2025 
Impact 1. ?Enhanced High-Frequency Communication Performance? TGV-based IPD filters enable ?low-loss signal transmission (<0.5 dB)? and ?high stopband rejection (>40 dB)? in 5G/6G millimeter-wave systems, improving data transfer efficiency and reducing interference in densely connected networks?. 2. ?Improved Integration in Multi-Domain Systems? Compatibility with semiconductor processes (e.g., photolithography) supports ?3D heterogeneous integration? of filters with active components, enabling compact designs for IoT and smart devices.