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Exploitation of High Voltage CMOS sensors for tracking applications in physics experiments and beyond

Lead Research Organisation: University of Liverpool
Department Name: Physics

Abstract

Silicon tracking detectors sit at the core of many particle and nuclear physics experiments to measure the trajectory of charged particles produced in collisions or decay processes. The specifications for these detectors are many and often extremely challenging, as they need to track with the highest possible accuracy the many billions of charged particles that are produced every second in an experiment. The state-of-the-art in silicon tracking detectors for the current generation of physics experiments consists of hybrid sensors in planar processes (combined with a separate readout chip) and monolithic sensors in industry-standard CMOS processes. While both approaches are successfully deployed in current experiments, such as the ATLAS and ALICE experiments at the Large Hadron Collider (LHC) at CERN, they are not able to meet all the requirements of future experiments in a single device. Monolithic silicon sensors in industry-standard High Voltage CMOS (HV-CMOS) processes, a variant of CMOS, are the strongest candidate to meet all the specifications for the next generation of physics experiments. HV-CMOS sensors integrate the sensing cell (i.e. the pixel) and the readout chip in a single device (i.e. a sensor chip) that can be as thin as 50 micrometers. HV-CMOS sensors provide good spatial resolution, fast time resolution, excellent radiation tolerance, all at very competitive cost per area. They were first proposed in 2007 and have matured significantly since then. Upcoming experiments that have selected or propose HV-CMOS for their silicon tracking detector, such as the Mu3e experiment at PSI in Switzerland and the Mighty Tracker upgrade for the LHCb experiment at CERN, will showcase its use for large tracking systems for the future.

In this research, I propose to deploy the highly-performant HV-CMOS sensor chips I have developed already in the first phase of my research programme in two physics experiments that will lead to the discovery of exciting new physics. I will target the proton Electric Dipole Moment (pEDM) search proposed by the JEDI collaboration at the COSY synchrotron in Germany initially, followed by the LHCb VELO detector upgrade at the High Luminosity LHC at CERN. Using my highly-performant HV-CMOS sensor chips, I will assemble technology demonstrators and evaluate them in the Liverpool clean rooms and international facilities to demonstrate they meet the specifications required by these experiments. I will seek the commercialisation of my highly radiation tolerant UKRI-MPW sensor technology for commercial applications beyond physics. To benefit the wider society, I will target applications in particle beam therapy, electron microscopy, nuclear facility monitoring and space. I will also deliver large area highly-performant HV-CMOS sensors that will incorporate all the lessons learned during the first phase of my research programme.

Publications

10 25 50

publication icon
Pilsl B (2024) Characterization of the RD50-MPW4 HV-CMOS pixel sensor in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

 
Description This project is delivering detector technology to fully exploit the physics programmes of future experiments, mainly at the planned Large Hadron Collider (LHC) upgrade at CERN and beyond.

The LHC is the world's most powerful scientific instrument, enabling groundbreaking discoveries like the Higgs Boson to advance our understanding of the fundamental laws of nature and the universe. A crucial aspect of physics experiments is particle tracking. As charged particles pass through the several layers that typically make a tracking detector, they leave a trace in each layer. Like following footprints on snowy paths to track and identify animals, physicists use traces in tracking detectors to reconstruct the trajectories of the particles and obtain key information to identify them (e.g. direction, charge and energy).

However, particle tracking presents significant technological challenges. To simplify this problem, physicists need extremely thin and fast sensors with tiny sensing cells that measure accurate trace points while dissipating little power. Additionally, sensors must be highly radiation-tolerant and cost-effective to survive many years of operation and cover large areas.

Sensors in High Voltage CMOS processes, a variant of CMOS processes typically used for consumer electronics such as digital cameras, are the most promising route for achieving thin monolithic detectors with excellent radiation tolerance. However, significant further R&D is necessary to combine the challenging specifications of low-mass (100 µm thickness) and high radiation tolerance (>1016 1 MeV equivalent neutrons per cm2) together with high timing (1 ns) and spatial resolution (100 µm cell size), high data rate (100 MHz/cm2) and low-power consumption (150 mW/cm2) into a single, full-scale sensing device (~ 2 cm x 2 cm, as the maximum size of each individual sensor).

This project is using industry-standard High Voltage CMOS processes to deliver a thin monolithic, high radiation-tolerant High Voltage CMOS sensor demonstrator for future physics experiments.
Exploitation Route Detector technology to enable future physics experiments.
Sectors Other

 
Description This grant and its findings are allowing us to develop a wide range of new skills to train the next generation of researchers and professionals to address the skills shortage in STEM.
First Year Of Impact 2024
Sector Education
Impact Types Societal

Policy & public services

 
Description DRD3 collaboration
Geographic Reach Multiple continents/international 
Policy Influence Type Participation in a guidance/advisory committee
URL https://drd3.web.cern.ch/
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation Carleton University
Country Canada 
Sector Academic/University 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation Fondazione Bruno Kessler
Country Italy 
Sector Private 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation Institute Josef Stefan
Country Slovenia 
Sector Academic/University 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation Institute of High Energy Physics
Country Austria 
Sector Public 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation Institute of Physics of Cantabria
Country Spain 
Sector Public 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation Lancaster University
Country United Kingdom 
Sector Academic/University 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation National Institute for Subatomic Physics Nikhef
Country Netherlands 
Sector Academic/University 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation National Institute of Materials Physics Magurele-Bucharest
Country Romania 
Sector Public 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation Ruder Boskovic Institute
Country Croatia 
Sector Public 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation University of Barcelona
Department Faculty of Physics
Country Spain 
Sector Academic/University 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation University of Birmingham
Country United Kingdom 
Sector Academic/University 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation University of Bonn
Country Germany 
Sector Academic/University 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description CMOS Working Group of the CERN-RD50 collaboration 
Organisation University of Seville
Country Spain 
Sector Academic/University 
PI Contribution I initiated and lead the CMOS Working Group of the CERN-RD50 collaboration, which currently involves more than 40 people from 17 institutes in 11 countries worldwide. I have led the simulation, design and submission of the RD50 CMOS detector prototypes developed so far (RD50-MPW1 in 2017, RD50-MPW2 in 2019, RD50-MPW3 in 2021, and RD50-MPW4 in 2023). We are currently active in: -) TCAD simulations: the University of Liverpool has done and continuous doing extensive Technology Computer-Aided Design (TCAD) simulations to anticipate the performance of the sensor before its fabrication. -) Sensor design: the University of Liverpool has co-designed and submitted all the RD50-MPW prototypes. -) DAQ development: HEPHY, IFIC and the University of Liverpool have developed the Data AcQuisition system (DAQ) to read out the CMOS detector prototypes designed by this working group. The DAQ is based on Caribou. In particular, Liverpool has played a crucial role in producing the Graphical User Interface (GUI) and reviewing the design of the printed circuit boards and firmware. -) Performance evaluation: all the institutes involved contribute to the measurement programme. JSI irradiates the samples at their facilities in the TRIGA reactor. Although the CERN-RD50 collaboration reached its end on 31.12.2023, all the partners have joined the new follow-up collaboration (DRD3) where the work to develop the sensor continues.
Collaborator Contribution -) CPPM, HEPHY, IFAE, IFIC, Barcelona, Bonn and Seville have co-designed RD50-MPW3. -) HEPHY and IFIC have developed the printed circuit boards and firmware to read out the CMOS detector prototypes designed by the collaboration. -) JSI have irradiated the samples to study their behaviour after irradiation. They have contributed to the measurement programme. -) We have measured prototypes at the ion beam facility at IRB. -) CPPM, HEPHY, IFAE, IFIC, NIKHEF, Lancaster and Seville have contributed to the measurement programme as well.
Impact -) CMOS detector prototypes -) DAQs for these prototypes
Start Year 2017
 
Description Mighty Tracker 
Organisation Heidelberg University
Country Germany 
Sector Academic/University 
PI Contribution I am one of the original proposers of the Mighty Tracker detector system major upgrade for the LHCb experiment at CERN, which proposes to use High Voltage CMOS sensors to meet the anticipated performance requirements. I co-coordinate the collaborative effort that is performing the High Voltage CMOS R&D for the Mighty Tracker globally (currently involves 14 international institutions), and in the UK for the eight UK groups participating in this project. With my team and international collaborators I am co-designing the Mighty-Pixel sensor (MightyPix and RadPix High Voltage CMOS chips).
Collaborator Contribution -) KIT provides sensor design; -) Bonn provides the DAQ; -) KIT, RAL, Bonn, Edinburgh, Heidelberg and Dortmund contribute with sensor performance evaluation; -) Manchester contributes with the mechanics design.
Impact MightyPix1 prototype delivered in January 2023. MightyPix2 prototype will be submitted in spring 2025, currently being designed. RadPix1 will be submitted in Q4 2025, currently being designed.
Start Year 2020
 
Description Mighty Tracker 
Organisation Karlsruhe Institute of Technology
Country Germany 
Sector Academic/University 
PI Contribution I am one of the original proposers of the Mighty Tracker detector system major upgrade for the LHCb experiment at CERN, which proposes to use High Voltage CMOS sensors to meet the anticipated performance requirements. I co-coordinate the collaborative effort that is performing the High Voltage CMOS R&D for the Mighty Tracker globally (currently involves 14 international institutions), and in the UK for the eight UK groups participating in this project. With my team and international collaborators I am co-designing the Mighty-Pixel sensor (MightyPix and RadPix High Voltage CMOS chips).
Collaborator Contribution -) KIT provides sensor design; -) Bonn provides the DAQ; -) KIT, RAL, Bonn, Edinburgh, Heidelberg and Dortmund contribute with sensor performance evaluation; -) Manchester contributes with the mechanics design.
Impact MightyPix1 prototype delivered in January 2023. MightyPix2 prototype will be submitted in spring 2025, currently being designed. RadPix1 will be submitted in Q4 2025, currently being designed.
Start Year 2020
 
Description Mighty Tracker 
Organisation Rutherford Appleton Laboratory
Department Space Science and Technology Department
Country United Kingdom 
Sector Academic/University 
PI Contribution I am one of the original proposers of the Mighty Tracker detector system major upgrade for the LHCb experiment at CERN, which proposes to use High Voltage CMOS sensors to meet the anticipated performance requirements. I co-coordinate the collaborative effort that is performing the High Voltage CMOS R&D for the Mighty Tracker globally (currently involves 14 international institutions), and in the UK for the eight UK groups participating in this project. With my team and international collaborators I am co-designing the Mighty-Pixel sensor (MightyPix and RadPix High Voltage CMOS chips).
Collaborator Contribution -) KIT provides sensor design; -) Bonn provides the DAQ; -) KIT, RAL, Bonn, Edinburgh, Heidelberg and Dortmund contribute with sensor performance evaluation; -) Manchester contributes with the mechanics design.
Impact MightyPix1 prototype delivered in January 2023. MightyPix2 prototype will be submitted in spring 2025, currently being designed. RadPix1 will be submitted in Q4 2025, currently being designed.
Start Year 2020
 
Description Mighty Tracker 
Organisation Swiss Federal Institute of Technology in Lausanne (EPFL)
Country Switzerland 
Sector Public 
PI Contribution I am one of the original proposers of the Mighty Tracker detector system major upgrade for the LHCb experiment at CERN, which proposes to use High Voltage CMOS sensors to meet the anticipated performance requirements. I co-coordinate the collaborative effort that is performing the High Voltage CMOS R&D for the Mighty Tracker globally (currently involves 14 international institutions), and in the UK for the eight UK groups participating in this project. With my team and international collaborators I am co-designing the Mighty-Pixel sensor (MightyPix and RadPix High Voltage CMOS chips).
Collaborator Contribution -) KIT provides sensor design; -) Bonn provides the DAQ; -) KIT, RAL, Bonn, Edinburgh, Heidelberg and Dortmund contribute with sensor performance evaluation; -) Manchester contributes with the mechanics design.
Impact MightyPix1 prototype delivered in January 2023. MightyPix2 prototype will be submitted in spring 2025, currently being designed. RadPix1 will be submitted in Q4 2025, currently being designed.
Start Year 2020
 
Description Mighty Tracker 
Organisation Technical University of Dortmund
Country Germany 
Sector Academic/University 
PI Contribution I am one of the original proposers of the Mighty Tracker detector system major upgrade for the LHCb experiment at CERN, which proposes to use High Voltage CMOS sensors to meet the anticipated performance requirements. I co-coordinate the collaborative effort that is performing the High Voltage CMOS R&D for the Mighty Tracker globally (currently involves 14 international institutions), and in the UK for the eight UK groups participating in this project. With my team and international collaborators I am co-designing the Mighty-Pixel sensor (MightyPix and RadPix High Voltage CMOS chips).
Collaborator Contribution -) KIT provides sensor design; -) Bonn provides the DAQ; -) KIT, RAL, Bonn, Edinburgh, Heidelberg and Dortmund contribute with sensor performance evaluation; -) Manchester contributes with the mechanics design.
Impact MightyPix1 prototype delivered in January 2023. MightyPix2 prototype will be submitted in spring 2025, currently being designed. RadPix1 will be submitted in Q4 2025, currently being designed.
Start Year 2020
 
Description Mighty Tracker 
Organisation University of Bonn
Country Germany 
Sector Academic/University 
PI Contribution I am one of the original proposers of the Mighty Tracker detector system major upgrade for the LHCb experiment at CERN, which proposes to use High Voltage CMOS sensors to meet the anticipated performance requirements. I co-coordinate the collaborative effort that is performing the High Voltage CMOS R&D for the Mighty Tracker globally (currently involves 14 international institutions), and in the UK for the eight UK groups participating in this project. With my team and international collaborators I am co-designing the Mighty-Pixel sensor (MightyPix and RadPix High Voltage CMOS chips).
Collaborator Contribution -) KIT provides sensor design; -) Bonn provides the DAQ; -) KIT, RAL, Bonn, Edinburgh, Heidelberg and Dortmund contribute with sensor performance evaluation; -) Manchester contributes with the mechanics design.
Impact MightyPix1 prototype delivered in January 2023. MightyPix2 prototype will be submitted in spring 2025, currently being designed. RadPix1 will be submitted in Q4 2025, currently being designed.
Start Year 2020
 
Description Mighty Tracker 
Organisation University of Edinburgh
Country United Kingdom 
Sector Academic/University 
PI Contribution I am one of the original proposers of the Mighty Tracker detector system major upgrade for the LHCb experiment at CERN, which proposes to use High Voltage CMOS sensors to meet the anticipated performance requirements. I co-coordinate the collaborative effort that is performing the High Voltage CMOS R&D for the Mighty Tracker globally (currently involves 14 international institutions), and in the UK for the eight UK groups participating in this project. With my team and international collaborators I am co-designing the Mighty-Pixel sensor (MightyPix and RadPix High Voltage CMOS chips).
Collaborator Contribution -) KIT provides sensor design; -) Bonn provides the DAQ; -) KIT, RAL, Bonn, Edinburgh, Heidelberg and Dortmund contribute with sensor performance evaluation; -) Manchester contributes with the mechanics design.
Impact MightyPix1 prototype delivered in January 2023. MightyPix2 prototype will be submitted in spring 2025, currently being designed. RadPix1 will be submitted in Q4 2025, currently being designed.
Start Year 2020
 
Description Mighty Tracker 
Organisation University of Glasgow
Country United Kingdom 
Sector Academic/University 
PI Contribution I am one of the original proposers of the Mighty Tracker detector system major upgrade for the LHCb experiment at CERN, which proposes to use High Voltage CMOS sensors to meet the anticipated performance requirements. I co-coordinate the collaborative effort that is performing the High Voltage CMOS R&D for the Mighty Tracker globally (currently involves 14 international institutions), and in the UK for the eight UK groups participating in this project. With my team and international collaborators I am co-designing the Mighty-Pixel sensor (MightyPix and RadPix High Voltage CMOS chips).
Collaborator Contribution -) KIT provides sensor design; -) Bonn provides the DAQ; -) KIT, RAL, Bonn, Edinburgh, Heidelberg and Dortmund contribute with sensor performance evaluation; -) Manchester contributes with the mechanics design.
Impact MightyPix1 prototype delivered in January 2023. MightyPix2 prototype will be submitted in spring 2025, currently being designed. RadPix1 will be submitted in Q4 2025, currently being designed.
Start Year 2020
 
Description Mighty Tracker 
Organisation University of Manchester
Country United Kingdom 
Sector Academic/University 
PI Contribution I am one of the original proposers of the Mighty Tracker detector system major upgrade for the LHCb experiment at CERN, which proposes to use High Voltage CMOS sensors to meet the anticipated performance requirements. I co-coordinate the collaborative effort that is performing the High Voltage CMOS R&D for the Mighty Tracker globally (currently involves 14 international institutions), and in the UK for the eight UK groups participating in this project. With my team and international collaborators I am co-designing the Mighty-Pixel sensor (MightyPix and RadPix High Voltage CMOS chips).
Collaborator Contribution -) KIT provides sensor design; -) Bonn provides the DAQ; -) KIT, RAL, Bonn, Edinburgh, Heidelberg and Dortmund contribute with sensor performance evaluation; -) Manchester contributes with the mechanics design.
Impact MightyPix1 prototype delivered in January 2023. MightyPix2 prototype will be submitted in spring 2025, currently being designed. RadPix1 will be submitted in Q4 2025, currently being designed.
Start Year 2020
 
Description Mighty Tracker 
Organisation University of Zurich
Country Switzerland 
Sector Academic/University 
PI Contribution I am one of the original proposers of the Mighty Tracker detector system major upgrade for the LHCb experiment at CERN, which proposes to use High Voltage CMOS sensors to meet the anticipated performance requirements. I co-coordinate the collaborative effort that is performing the High Voltage CMOS R&D for the Mighty Tracker globally (currently involves 14 international institutions), and in the UK for the eight UK groups participating in this project. With my team and international collaborators I am co-designing the Mighty-Pixel sensor (MightyPix and RadPix High Voltage CMOS chips).
Collaborator Contribution -) KIT provides sensor design; -) Bonn provides the DAQ; -) KIT, RAL, Bonn, Edinburgh, Heidelberg and Dortmund contribute with sensor performance evaluation; -) Manchester contributes with the mechanics design.
Impact MightyPix1 prototype delivered in January 2023. MightyPix2 prototype will be submitted in spring 2025, currently being designed. RadPix1 will be submitted in Q4 2025, currently being designed.
Start Year 2020
 
Title Compensating Feedback Pixel for High Resolution Timing 
Description Electronics circuit for improve timing resolution. 
IP Reference  
Protection Patent / Patent application
Year Protection Granted 2024
Licensed No