ATLAS Upgrade 2014-16

Lead Research Organisation: University of Liverpool
Department Name: Physics

Abstract

Refer to ATLAS-UK upgrade proposal to PPRP: "UPGRADING THE ATLAS EXPERIMENT FOR THE LUMINOSITY FRONTIER AT THE LARGE HADRON COLLIDER" PPRP meeting, September 2012

Planned Impact

Refer to ATLAS-UK upgrade proposal to PPRP: "UPGRADING THE ATLAS EXPERIMENT FOR THE LUMINOSITY FRONTIER AT THE LARGE HADRON COLLIDER" PPRP meeting, September 2012

Publications

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Affolder A (2016) Charge collection studies in irradiated HV-CMOS particle detectors in Journal of Instrumentation

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Allport P (2014) Development of planar pixel modules for the ATLAS high luminosity LHC tracker upgrade in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

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Benítez V (2016) Sensors for the End-cap prototype of the Inner Tracker in the ATLAS Detector Upgrade in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

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Bernabeu J (2016) ALIBAVA Silicon Microstrip Readout System for Educational Purposes in Nuclear and Particle Physics Proceedings

 
Description The Large Hadron Collider has made a great scientific and social impact. The Higgs boson discovery has opened a new window into our understanding of the university and has captured people's imagination. The potential for even further discoveries at the LHC is high.

To remain on the forefront of discovery, the LHC and its experiments need a series of upgrades to manage the harsh environment. This grant is one in a series of grants to support the Phase II upgrade of the silicon tracker of the ATLAS experiment, which is expected to install in 2024-2025. The tracker will take "pictures" of the trajectories of charged particles created by the collisions of protons every 25 ns.

In this grant period, techniques have been developed which will enable the production of this complex detector within the funding constraints which meet the performance targets. Near production prototypes have been made for both the pixel and strip systems. A major milestone has been completed with the submission of the Technical Design Report of the Strip Detector to the LHCC review committee at CERN.
Exploitation Route The development of radiation hard sensors will be useful for medical physics (proton therapy, amongst others) and nuclear material monitoring, as well as future nuclear and particle physics experiments.

The developments needed for light, carbon-fibre structures for the upgrade have been used in other departments in the University. In particular, the mechanical engineering formula student program has made a number of components using our techniques.
Sectors Education,Environment,Healthcare,Other

 
Description Through the development of hybrid circuits and pixel sensors with UK industry, we have enabled them to bid for a contracts worth in excess of a million pounds.
First Year Of Impact 2006
Sector Electronics,Manufacturing, including Industrial Biotechology
Impact Types Economic

 
Description CERN RD50 funding request
Amount SFr. 15,000 (CHF)
Organisation European Organization for Nuclear Research (CERN) 
Sector Public
Country Switzerland
Start 11/2017 
End 11/2017
 
Description ATLAS upgrade strip hybrids circuits 
Organisation Stevenage Circuits
Country United Kingdom 
Sector Private 
PI Contribution Design and definition of hybrid circuit specifications
Collaborator Contribution Development and design of production process. Production of circuits
Impact Stevenage circuits has produced all hybrid circuits for ATLAS barrel upgrade so far. It is in a fabulous position to bid for the ~£2M production order.
Start Year 2009
 
Description HV-CMOS collaboration 
Organisation Brookhaven National Laboratory
Country United States 
Sector Public 
PI Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Collaborator Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Impact First prototype pixel sensors in AMS 350 nm HV-CMOS technology
Start Year 2014
 
Description HV-CMOS collaboration 
Organisation Heidelberg University
Country Germany 
Sector Academic/University 
PI Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Collaborator Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Impact First prototype pixel sensors in AMS 350 nm HV-CMOS technology
Start Year 2014
 
Description HV-CMOS collaboration 
Organisation IFIC Barcelona
Country Spain 
Sector Private 
PI Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Collaborator Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Impact First prototype pixel sensors in AMS 350 nm HV-CMOS technology
Start Year 2014
 
Description HV-CMOS collaboration 
Organisation Karlsruhe Institute of Technology
Country Germany 
Sector Academic/University 
PI Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Collaborator Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Impact First prototype pixel sensors in AMS 350 nm HV-CMOS technology
Start Year 2014
 
Description HV-CMOS collaboration 
Organisation University of Bern
Department Institute for Surgical Technology and Biomechanics
Country Switzerland 
Sector Academic/University 
PI Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Collaborator Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Impact First prototype pixel sensors in AMS 350 nm HV-CMOS technology
Start Year 2014
 
Description HV-CMOS collaboration 
Organisation University of Geneva
Department Physics Section
Country Switzerland 
Sector Academic/University 
PI Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Collaborator Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Impact First prototype pixel sensors in AMS 350 nm HV-CMOS technology
Start Year 2014
 
Description HV-CMOS collaboration 
Organisation University of Tsukuba
Country Japan 
Sector Academic/University 
PI Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Collaborator Contribution Design, cost sharing for submissions and evaluation of prototype HV-CMOS devices
Impact First prototype pixel sensors in AMS 350 nm HV-CMOS technology
Start Year 2014
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Brookhaven National Laboratory
Department Physics Department
Country United States 
Sector Public 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Lawrence Berkeley National Laboratory
Department Physics Division
Country United States 
Sector Public 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Penn State University
Department Department of Physics
Country United States 
Sector Academic/University 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description UK-US power boards for ATLAS upgrade strip barrel modules 
Organisation Yale University
Department Department of Chemistry
Country United States 
Sector Academic/University 
PI Contribution Research and development of small form factor powerboard
Collaborator Contribution Development of coils and future asic controller.
Impact This work enables the US to take this ASIC as a deliverable for the ATLAS upgrade project.
Start Year 2016
 
Description development of a multiple hybrid panel crate based DAQ system 
Organisation Deutsches Electronen-Synchrotron (DESY)
Country Germany 
Sector Academic/University 
PI Contribution Development of hardware for testing of data transimissions, for data rates upto 640Mbit/s.
Collaborator Contribution Development of firmware for testing and analysis of data transimissions, for data rates upto 640Mbit/s.
Impact Results presented at ATLAS collaboration meetings.
Start Year 2016
 
Description development of a multiple hybrid panel crate based DAQ system 
Organisation Rutherford Appleton Laboratory
Country United Kingdom 
Sector Public 
PI Contribution Development of hardware for testing of data transimissions, for data rates upto 640Mbit/s.
Collaborator Contribution Development of firmware for testing and analysis of data transimissions, for data rates upto 640Mbit/s.
Impact Results presented at ATLAS collaboration meetings.
Start Year 2016
 
Description development of a multiple hybrid panel crate based DAQ system 
Organisation University of Toronto
Department Department of Physics
Country Canada 
Sector Academic/University 
PI Contribution Development of hardware for testing of data transimissions, for data rates upto 640Mbit/s.
Collaborator Contribution Development of firmware for testing and analysis of data transimissions, for data rates upto 640Mbit/s.
Impact Results presented at ATLAS collaboration meetings.
Start Year 2016
 
Description development of assembly tooling and method for strip hybrids 
Organisation Albert Ludwigs University of Freiburg
Department Department of Physics
Country Switzerland 
Sector Academic/University 
PI Contribution Development of design of assembly tooling and electrical circuit boards.
Collaborator Contribution Development of design of assembly tooling for alternative method.
Impact Final tools have been designed for the production strip barrel modules. Endcaps will follow the same concept. Tooling design has been shared with the international collaboration.
Start Year 2016
 
Title Engineering run submission to AMS in H18 CMOS process 
Description Co-design of submission including ATLAS pixel devices and MuPix8 Matrix. 
Type Of Technology Detection Devices 
Year Produced 2016 
Impact Device not yet back from manufacturer. Evaluation still to come. 
 
Title H35DEMO: Engineering run submission to AMS in h35 process 
Description Prototype pixel sensors with both hybrid and fully monolithic pixel arrays in AMS 350nm High Voltage CMOS technology node 
Type Of Technology Detection Devices 
Year Produced 2015 
Impact Testing of the novel devices and further development of the technology will take place in 2016. 
 
Title Lfoundry MPW submission in their 150 nm HV-CMOS process. 
Description Co-design of MPW submission including ATLAS and mu3e test devices 
Type Of Technology Detection Devices 
Year Produced 2016 
Impact Evaluation is ongoing. 
 
Title Lfoundry MPW submission of small pixel prototype 
Description Prototype to demonstrate 50x50 micorn pixel matrix with high level of in-pixel electronics. 
Type Of Technology Detection Devices 
Year Produced 2016 
Impact Device will be received back from manufacturer in early 2017. Evalulation still to come. 
 
Title MPW run submission to AMS in H18 CMOS process through Europractice 
Description Co-design of submission including ATLAS pixel devices 
Type Of Technology Detection Devices 
Year Produced 2017 
Impact Device not yet back from manufacturer. Evaluation still to come.