Cost-Effective TSV Grouping for Yield Improvement of 3D-ICs (2011)

First Author: Zhao Y

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ats.2011.37

Publication URI: http://dx.doi.org/10.1109/ats.2011.37

Type: Conference/Paper/Proceeding/Abstract

ISBN: 978-1-4577-1984-4