Cost-Effective TSV Grouping for Yield Improvement of 3D-ICs (2011)
Attributed to:
Variation-Aware Test for NanoScale CMOS Integrated Circuits
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/ats.2011.37
Publication URI: http://dx.doi.org/10.1109/ats.2011.37
Type: Conference/Paper/Proceeding/Abstract
ISBN: 978-1-4577-1984-4