Degradation of thermal interface materials for high-temperature power electronics applications (2013)
Attributed to:
Power Electronics for Adverse High Temperature Environments (PEATE)
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2013.05.011
Publication URI: http://dx.doi.org/10.1016/j.microrel.2013.05.011
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability
Issue: 12