Impact of Thermal Cycling in Humid Environments on Power Electronic Modules (2012)

First Author: Wang N

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2012.2195781

Publication URI: http://dx.doi.org/10.1109/tcpmt.2012.2195781

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue: 7