THz Applications for the Engineering Approach to Modelling Frequency Dispersion within Normal Metals at Room Temperature (2010)
Attributed to:
Platform Support for 3D Electrical MEMS
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.2529/piers090907203625
Publication URI: http://dx.doi.org/10.2529/piers090907203625
Type: Journal Article/Review
Parent Publication: PIERS Online
Issue: 3