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Thick-film acoustic emission sensors for use in structurally integrated condition-monitoring applications. (2011)

First Author: Pickwell AJ
Attributed to:  Bridging Applied Nano-Technologists (Bridging ANTs) funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tuffc.2011.2043

PubMed Identifier: 21937337

Publication URI: http://europepmc.org/abstract/MED/21937337

Type: Journal Article/Review

Volume: 58

Parent Publication: IEEE transactions on ultrasonics, ferroelectrics, and frequency control

Issue: 9

ISSN: 0885-3010