Thick-film acoustic emission sensors for use in structurally integrated condition-monitoring applications. (2011)

First Author: Pickwell AJ

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/TUFFC.2011.2043

PubMed Identifier: 21937337

Publication URI: http://europepmc.org/abstract/MED/21937337

Type: Journal Article/Review

Volume: 58

Parent Publication: IEEE transactions on ultrasonics, ferroelectrics, and frequency control

Issue: 9

ISSN: 0885-3010