Framework flexibility and the negative thermal expansion mechanism of copper(I) oxide Cu 2 O (2014)

First Author: Rimmer L
Attributed to:  Modelling of Advanced Functional Materials using Terascale Computing funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1103/physrevb.89.214115

Publication URI: http://dx.doi.org/10.1103/physrevb.89.214115

Type: Journal Article/Review

Parent Publication: Physical Review B

Issue: 21