Calibration of a Novel Microstructural Damage Model for Wire Bonds (2014)

First Author: Yang L
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tdmr.2014.2354739

Publication URI: http://dx.doi.org/10.1109/tdmr.2014.2354739

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Device and Materials Reliability

Issue: 4