Calibration of a Novel Microstructural Damage Model for Wire Bonds (2014)
Attributed to:
An Innovative Electronics Manufacturing Research Centre
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tdmr.2014.2354739
Publication URI: http://dx.doi.org/10.1109/tdmr.2014.2354739
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Device and Materials Reliability
Issue: 4