Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects (2015)

First Author: Jianfeng Li
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2014.2357334

Publication URI: http://dx.doi.org/10.1109/tpel.2014.2357334

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Power Electronics

Issue: 5