The effect of electroplating parameters and substrate material on tin whisker formation (2015)
Attributed to:
An Innovative Electronics Manufacturing Research Centre
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2014.10.005
Publication URI: http://dx.doi.org/10.1016/j.microrel.2014.10.005
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability
Issue: 1
ISSN: 0026-2714