The effect of electroplating parameters and substrate material on tin whisker formation (2015)

First Author: Ashworth M
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2014.10.005

Publication URI: http://dx.doi.org/10.1016/j.microrel.2014.10.005

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

Issue: 1

ISSN: 0026-2714