📣 Help Shape the Future of UKRI's Gateway to Research (GtR)

We're improving UKRI's Gateway to Research and are seeking your input! If you would be interested in being interviewed about the improvements we're making and to have your say about how we can make GtR more user-friendly, impactful, and effective for the Research and Innovation community, please email gateway@ukri.org.

Characterisation of tin-copper intermetallic growth in electrodeposited tin coatings using electrochemical oxidation techniques (2014)

First Author: Stuttle C

Attributed to: An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1179/0020296714z.000000000174

Publication URI: http://dx.doi.org/10.1179/0020296714z.000000000174

Type: Journal Article/Review

Parent Publication: Transactions of the IMF

Issue: 5

ISSN: 0020-2967