An Evaluation of Sn-Cu-Ga and Sn-Cu-Ag Solder Alloys for Applications within the Electronics Industry (2014)
Attributed to:
An Innovative Electronics Manufacturing Research Centre
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.4028/www.scientific.net/ssp.216.91
Publication URI: http://dx.doi.org/10.4028/www.scientific.net/ssp.216.91
Type: Journal Article/Review
Parent Publication: Solid State Phenomena