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Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation (2013)

First Author: Costello S

Attributed to: An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s00542-013-1746-7

Publication URI: http://dx.doi.org/10.1007/s00542-013-1746-7

Type: Journal Article/Review

Parent Publication: Microsystem Technologies

Issue: 6

ISSN: 0946-7076