Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment (2014)
Attributed to:
An Innovative Electronics Manufacturing Research Centre
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11664-013-2971-7
Publication URI: http://dx.doi.org/10.1007/s11664-013-2971-7
Type: Journal Article/Review
Parent Publication: Journal of Electronic Materials
Issue: 4