Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment (2014)

First Author: Li J
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-013-2971-7

Publication URI: http://dx.doi.org/10.1007/s11664-013-2971-7

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 4