Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods (2014)

First Author: Arjmand E
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2014.07.119

Publication URI: http://dx.doi.org/10.1016/j.microrel.2014.07.119

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

Issue: 9-10