A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module (2015)

First Author: Rajaguru P
Attributed to:  An Innovative Electronics Manufacturing Research Centre funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2015.07.047

Publication URI: http://dx.doi.org/10.1016/j.microrel.2015.07.047

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

Issue: 11

ISSN: 0026-2714