Impact of uneven solder thickness on IGBT substrate reliability (2015)

First Author: Lu H
Attributed to:  Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ectc.2015.7159858

Publication URI: http://dx.doi.org/10.1109/ectc.2015.7159858

Type: Conference/Paper/Proceeding/Abstract