Electromigration in Sn-Ag solder thin films under high current density (2014)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.tsf.2014.06.030

Publication URI: http://dx.doi.org/10.1016/j.tsf.2014.06.030

Type: Journal Article/Review

Parent Publication: Thin Solid Films